Lay; Shinn-Juh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lay; Shinn-Juh.The latest application filed is for "multi-functional composite substrate structure".

Company Profile

0.10.12

Lay; Shinn-Juh - Hsinchu TW
Lay; Shinn-Juh - Chutung Hsinchu TW
Lay; Shinn-Juh - Hsinchu County TW
Lay; Shinn-Juh - Jhudong Township Hsinchu County TW
Lay, Shinn-Juh - Chutung Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-functional composite substrate structure Grant 8,174,840 - Jow , et al. May 8, 2	2012-05-08
Complementary mirror image embedded planar resistor architecture Grant 8,035,036 - Jow , et al. October 11, 2	2011-10-11
Embedded capacitor core having a multiple-layer structure Grant 7,893,359 - Wu , et al. February 22, 2	2011-02-22
Embedded capacitor device having a common coupling area Grant 7,875,808 - Chang , et al. January 25, 2	2011-01-25
Method for testing component built in circuit board Grant 7,714,590 - Jow , et al. May 11, 2	2010-05-11
Multi-functional composite substrate structure Grant 7,515,435 - Jow , et al. April 7, 2	2009-04-07
Multi-functional Composite Substrate Structure App 20090051469 - Jow; Uei-Ming ; et al.	2009-02-26
Complementary Mirror Image Embedded Planar Resistor Architecture App 20080093113 - Jow; Uei-Ming ; et al.	2008-04-24
Composite distributed dielectric structure Grant 7,349,196 - Chang , et al. March 25, 2	2008-03-25
Apparatus and method for testing component built in circuit board Grant 7,345,366 - Jow , et al. March 18, 2	2008-03-18
Chip Package With Built-in Capacitor Structure App 20070164395 - Perng; Jiin-Shing ; et al.	2007-07-19
Multi-functional composite substrate structure App 20070164396 - Jow; Uei-Ming ; et al.	2007-07-19
Method for testing component built in circuit board App 20070152339 - Jow; Uei-Ming ; et al.	2007-07-05
Embedded Capacitor Core Having A Multiple-layer Structure App 20070062725 - WU; Shih-Hsien ; et al.	2007-03-22
Embedded Capacitor Device Having A Common Coupling Area App 20070062726 - Chang; Huey-Ru ; et al.	2007-03-22
Composite distributed dielectric structure App 20060285273 - Chang; Chih-Hao ; et al.	2006-12-21
Apparatus and method for testing component built in circuit board App 20060261482 - Jow; Uei-Ming ; et al.	2006-11-23
Buried array capacitor and microelectronic structure incorporating the same Grant 7,064,427 - Chung , et al. June 20, 2	2006-06-20
Buried Array Capacitor And Microelectronic Structure Incorporating The Same App 20050269685 - Chung, Stephen ; et al.	2005-12-08
Compositive laminate substrate with inorganic substrate and organic substrate App 20040211954 - Wu, Shih-Hsien ; et al.	2004-10-28
Packaging structure with low switching noises Grant 6,683,781 - Ho , et al. January 27, 2	2004-01-27
Packaging Structure With Low Switching Noises App 20030217858 - Ho, Ted C. ; et al.	2003-11-27

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