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Patent applications and USPTO patent grants for Lay; Shinn-Juh.The latest application filed is for "multi-functional composite substrate structure".
Patent | Date |
---|---|
Multi-functional composite substrate structure Grant 8,174,840 - Jow , et al. May 8, 2 | 2012-05-08 |
Complementary mirror image embedded planar resistor architecture Grant 8,035,036 - Jow , et al. October 11, 2 | 2011-10-11 |
Embedded capacitor core having a multiple-layer structure Grant 7,893,359 - Wu , et al. February 22, 2 | 2011-02-22 |
Embedded capacitor device having a common coupling area Grant 7,875,808 - Chang , et al. January 25, 2 | 2011-01-25 |
Method for testing component built in circuit board Grant 7,714,590 - Jow , et al. May 11, 2 | 2010-05-11 |
Multi-functional composite substrate structure Grant 7,515,435 - Jow , et al. April 7, 2 | 2009-04-07 |
Multi-functional Composite Substrate Structure App 20090051469 - Jow; Uei-Ming ;   et al. | 2009-02-26 |
Complementary Mirror Image Embedded Planar Resistor Architecture App 20080093113 - Jow; Uei-Ming ;   et al. | 2008-04-24 |
Composite distributed dielectric structure Grant 7,349,196 - Chang , et al. March 25, 2 | 2008-03-25 |
Apparatus and method for testing component built in circuit board Grant 7,345,366 - Jow , et al. March 18, 2 | 2008-03-18 |
Chip Package With Built-in Capacitor Structure App 20070164395 - Perng; Jiin-Shing ;   et al. | 2007-07-19 |
Multi-functional composite substrate structure App 20070164396 - Jow; Uei-Ming ;   et al. | 2007-07-19 |
Method for testing component built in circuit board App 20070152339 - Jow; Uei-Ming ;   et al. | 2007-07-05 |
Embedded Capacitor Core Having A Multiple-layer Structure App 20070062725 - WU; Shih-Hsien ;   et al. | 2007-03-22 |
Embedded Capacitor Device Having A Common Coupling Area App 20070062726 - Chang; Huey-Ru ;   et al. | 2007-03-22 |
Composite distributed dielectric structure App 20060285273 - Chang; Chih-Hao ;   et al. | 2006-12-21 |
Apparatus and method for testing component built in circuit board App 20060261482 - Jow; Uei-Ming ;   et al. | 2006-11-23 |
Buried array capacitor and microelectronic structure incorporating the same Grant 7,064,427 - Chung , et al. June 20, 2 | 2006-06-20 |
Buried Array Capacitor And Microelectronic Structure Incorporating The Same App 20050269685 - Chung, Stephen ;   et al. | 2005-12-08 |
Compositive laminate substrate with inorganic substrate and organic substrate App 20040211954 - Wu, Shih-Hsien ;   et al. | 2004-10-28 |
Packaging structure with low switching noises Grant 6,683,781 - Ho , et al. January 27, 2 | 2004-01-27 |
Packaging Structure With Low Switching Noises App 20030217858 - Ho, Ted C. ;   et al. | 2003-11-27 |
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