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Patent applications and USPTO patent grants for Lay; Ming-Yi.The latest application filed is for "metal bump with an insulating sidewall and method of fabricating thereof".
Patent | Date |
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Metal bump with an insulating sidewall and method of fabricating thereof Grant 7,041,589 - Lay , et al. May 9, 2 | 2006-05-09 |
Metal bump with an insulating sidewall and method of fabricating thereof Grant 6,958,539 - Lay , et al. October 25, 2 | 2005-10-25 |
Metal bump with an insulating sidewall and method of fabricating thereof App 20040048202 - Lay, Ming-Yi ;   et al. | 2004-03-11 |
Test device and method Grant 6,489,783 - Liu , et al. December 3, 2 | 2002-12-03 |
Metal bump with an insulating sidewall and method of fabricating thereof App 20020048924 - Lay, Ming-Yi ;   et al. | 2002-04-25 |
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