Lawrence; Elena

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lawrence; Elena.The latest application filed is for "apparatus and method for the minimization of undercut during a ubm etch process".

Company Profile

4.6.6

Lawrence; Elena - Media PA
Lawrence; Elena - Horsham PA
Lawrence; Elena - East Norriton PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and method for the minimization of undercut during a UBM etch process Grant 11,069,583 - Taddei , et al. July 20, 2	2021-07-20
Apparatus and method for the minimization of undercut during a UBM etch process Grant 11,004,755 - Taddei , et al. May 11, 2	2021-05-11
Apparatus and Method for the Minimization of Undercut During a UBM Etch Process App 20200091014 - Taddei; John ; et al.	2020-03-19
Two etch method for achieving a wafer thickness profile Grant 10,553,502 - Mauer , et al. Fe	2020-02-04
Apparatus and Method for the Minimization of Undercut During a UBM Etch Process App 20190393108 - Taddei; John ; et al.	2019-12-26
System And Method For Performing A Wet Etching Process App 20180294196 - Mauer; Laura ; et al.	2018-10-11
Method of etching the back of a wafer to expose TSVs Grant 10,026,660 - Mauer , et al. July 17, 2	2018-07-17
System and method for performing a wet etching process Grant 9,698,062 - Mauer , et al. July 4, 2	2017-07-04
Apparatus and method for removing challenging polymer films and structures from semiconductor wafers Grant 9,541,837 - Taddei , et al. January 10, 2	2017-01-10
System And Method For Performing A Wet Etching Process App 20160126148 - Mauer; Laura ; et al.	2016-05-05
Apparatus and Method for Removing Challenging Polymer Films and Structures from Semiconductor Wafers App 20140377951 - Taddei; John ; et al.	2014-12-25
System And Method For Performing A Wet Etching Process App 20140242731 - Mauer; Laura ; et al.	2014-08-28

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