Lawlyes; Daniel A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lawlyes; Daniel A..The latest application filed is for "multiple hydraulic circuit pressure sensor".
- Lawlyes; Daniel A. - Kokomo IN US
- Lawlyes; Daniel A. - Cicero IN
| Patent | Date |
|---|---|
| Multiple Hydraulic Circuit Pressure Sensor App 20130036826 - Dahlgren; Daniel R. ; et al. | 2013-02-14 |
| Electronic enclosure with continuous ground contact surface Grant 7,563,992 - Lawlyes , et al. July 21, 2 | 2009-07-21 |
| Method of making an electronic assembly Grant 7,510,108 - Lawlyes , et al. March 31, 2 | 2009-03-31 |
| Electronic enclosure with continuous ground contact surface App 20080066956 - Lawlyes; Daniel A. ; et al. | 2008-03-20 |
| Sealed electronic component App 20080053700 - O'Connor; Kurt F. ; et al. | 2008-03-06 |
| Electronics enclosure and method of fabricating an electronics enclosure Grant 7,294,007 - Lawlyes November 13, 2 | 2007-11-13 |
| Method of making an electronic assembly App 20070023488 - Lawlyes; Daniel A. ; et al. | 2007-02-01 |
| Relaxed tolerance flip chip assembly Grant 6,998,706 - Lawlyes February 14, 2 | 2006-02-14 |
| Relaxed tolerance flip chip assembly App 20050098900 - Lawlyes, Daniel A. | 2005-05-12 |
| Heat sink with integrated electronics App 20050088824 - Buehler, David P. ; et al. | 2005-04-28 |
| Relaxed tolerance flip chip assembly App 20050040521 - Lawlyes, Daniel A. | 2005-02-24 |
| Heat sink with integrated electronics Grant 6,822,868 - Buehler , et al. November 23, 2 | 2004-11-23 |
| Relaxed tolerance flip chip assembly Grant 6,821,816 - Lawlyes November 23, 2 | 2004-11-23 |
| Apparatus for golf putting practice Grant 6,626,767 - Lawlyes September 30, 2 | 2003-09-30 |
| Heat sink with integrated electronics App 20030161106 - Buehler, David P. ; et al. | 2003-08-28 |
| High density wire bondable connector assembly App 20030143899 - Fulk, Mikel R. ; et al. | 2003-07-31 |
| Apparatus for golf putting practice App 20030130053 - Lawlyes, Daniel A. | 2003-07-10 |
| Electronic enclosure with improved EMC performance Grant 6,549,426 - Lawlyes , et al. April 15, 2 | 2003-04-15 |
| Partitioned circuit assembly App 20030035278 - Lawlyes, Daniel A. ; et al. | 2003-02-20 |
| Air/fuel module with integrated components and electronics App 20010045206 - Smith, Daniel F. ; et al. | 2001-11-29 |
| High density wirebond connector assembly App 20010031569 - Lawlyes, Daniel A. | 2001-10-18 |
| Method of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a terminal frame Grant 5,359,761 - Whitson , et al. November 1, 1 | 1994-11-01 |
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