Law; Shao Beng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Law; Shao Beng.The latest application filed is for "methods of protecting structure of integrated circuit from rework".
- Law; Shao Beng - Watervliet NY
- LAW; Shao Beng - Singapore SG
| Patent | Date |
|---|---|
| Line end structures for semiconductor devices Grant 10,770,392 - Licausi , et al. Sep | 2020-09-08 |
| Structure and method to reduce shorts and contact resistance in semiconductor devices Grant 10,741,495 - Singh , et al. A | 2020-08-11 |
| Methods of protecting structure of integrated circuit from rework Grant 10,636,656 - Sun , et al. | 2020-04-28 |
| Overlay mark structures Grant 10,627,720 - Sun , et al. | 2020-04-21 |
| Metal interconnects for super (skip) via integration Grant 10,573,593 - Lin , et al. Feb | 2020-02-25 |
| Via and skip via structures Grant 10,485,111 - Law , et al. Nov | 2019-11-19 |
| Methods Of Protecting Structure Of Integrated Circuit From Rework App 20190318927 - Sun; Lei ; et al. | 2019-10-17 |
| Multiple patterning with mandrel cuts formed using a block mask Grant 10,395,926 - Tang , et al. A | 2019-08-27 |
| Structure And Method To Reduce Shorts And Contact Resistance In Semiconductor Devices App 20190221523 - Singh; Sunil K. ; et al. | 2019-07-18 |
| Back-end-of-line Structures With Air Gaps App 20190206718 - LiCausi; Nicholas V. ; et al. | 2019-07-04 |
| Pre-spacer self-aligned cut formation Grant 10,236,256 - Zhang , et al. | 2019-03-19 |
| Overlay Mark Structures App 20190056671 - Sun; Lei ; et al. | 2019-02-21 |
| Via and skip via structures Grant 10,199,261 - McMahon , et al. Fe | 2019-02-05 |
| Via And Skip Via Structures App 20190027401 - McMahon; James ; et al. | 2019-01-24 |
| Via And Skip Via Structures App 20190021176 - Law; Shao Beng ; et al. | 2019-01-17 |
| Non-mandrel cut formation Grant 10,163,633 - Law , et al. Dec | 2018-12-25 |
| Etch profile control during skip via formation Grant 10,109,526 - Zhang , et al. October 23, 2 | 2018-10-23 |
| Pre-spacer Self-aligned Cut Formation App 20180301413 - Zhang; Xunyuan ; et al. | 2018-10-18 |
| Metal Interconnects For Super (skip) Via Integration App 20180269150 - LIN; Sean Xuan ; et al. | 2018-09-20 |
| Non-mandrel Cut Formation App 20180261457 - Law; Shao Beng ; et al. | 2018-09-13 |
| Self-aligned lithographic patterning Grant 10,056,292 - Law , et al. August 21, 2 | 2018-08-21 |
| Post spacer self-aligned cuts Grant 10,056,291 - Law , et al. August 21, 2 | 2018-08-21 |
| Metal interconnects for super (skip) via integration Grant 10,026,687 - Lin , et al. July 17, 2 | 2018-07-17 |
| Methods of forming integrated circuit structure using extreme ultraviolet photolithography technique and related integrated circuit structure Grant 10,014,297 - Sun , et al. July 3, 2 | 2018-07-03 |
| Post Spacer Self-aligned Cuts App 20180144976 - LAW; Shao Beng ; et al. | 2018-05-24 |
| Self-aligned Lithographic Patterning App 20180144979 - Law; Shao Beng ; et al. | 2018-05-24 |
| Pre-spacer self-aligned cut formation Grant 9,966,338 - Zhang , et al. May 8, 2 | 2018-05-08 |
| Self-aligned non-mandrel cut formation for tone inversion Grant 9,905,424 - Law February 27, 2 | 2018-02-27 |
| Skip via structures Grant 9,805,972 - Zhang , et al. October 31, 2 | 2017-10-31 |
| Apparatus And Methods For Cleaning And Drying Of Wafers App 20120255586 - SEAH; Boon Meng ; et al. | 2012-10-11 |
| Apparatus and methods for cleaning and drying of wafers Grant 8,177,993 - Seah , et al. May 15, 2 | 2012-05-15 |
| Apparatus and methods for Cleaning and Drying of wafers App 20080105653 - Seah; Boon Meng ; et al. | 2008-05-08 |
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