Law; Kam S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Law; Kam S..The latest application filed is for "method and apparatus for encapsulation of an organic light emitting diode".

Company Profile

4.54.30

Law; Kam S. - San Jose CA
- San Jose CA US
Law; Kam S. - Union City CA
LAW , KAM S - UNION CITY CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for encapsulation of an organic light emitting diode Grant 10,333,104 - Law , et al.	2019-06-25
Method And Apparatus For Encapsulation Of An Organic Light Emitting Diode App 20180130975 - Law; Kam S. ; et al.	2018-05-10
Auto-sequencing multi-directional inline processing method Grant 9,287,152 - Blonigan , et al. March 15, 2	2016-03-15
Auto-sequencing inline processing apparatus Grant 8,672,603 - Blonigan , et al. March 18, 2	2014-03-18
Showerhead assembly for plasma processing chamber Grant 08617349 -	2013-12-31
Showerhead assembly for plasma processing chamber Grant 8,617,349 - Law , et al. December 31, 2	2013-12-31
Auto-sequencing Multi-directional Inline Processing Method App 20130294678 - Blonigan; Wendell Thomas ; et al.	2013-11-07
Auto-sequencing multi-directional inline processing apparatus Grant 8,444,364 - Blonigan , et al. May 21, 2	2013-05-21
Susceptor For Plasma Processing Chamber App 20110315081 - Law; Kam S. ; et al.	2011-12-29
Auto-sequencing Inline Processing Apparatus App 20110142572 - BLONIGAN; Wendell Thomas ; et al.	2011-06-16
Auto-sequencing Multi-directional Inline Processing Apparatus App 20110142573 - BLONIGAN; Wendell Thomas ; et al.	2011-06-16
Showerhead Assembly For Plasma Processing Chamber App 20110088847 - LAW; Kam S. ; et al.	2011-04-21
Chemical vapor deposition apparatus and electrode plate thereof App 20070151516 - Law; Kam S. ; et al.	2007-07-05
Method for depositing porous films Grant 7,220,685 - Mak , et al. May 22, 2	2007-05-22
Method for depositing porous films App 20060252278 - Mak; Cecilia Y. ; et al.	2006-11-09
Method for depositing porous films Grant 7,132,374 - Mak , et al. November 7, 2	2006-11-07
Plasma display panel with a low K dielectric layer Grant 7,122,962 - Law , et al. October 17, 2	2006-10-17
Optical integrated circuits (ICs) Grant 7,087,179 - Mak , et al. August 8, 2	2006-08-08
Method for plasma etching a dielectric layer Grant 7,056,830 - Merry , et al. June 6, 2	2006-06-06
Method and apparatus for metallization of large area substrates Grant 7,029,529 - Law , et al. April 18, 2	2006-04-18
Method for depositing porous films App 20060040507 - Mak; Cecilia Y. ; et al.	2006-02-23
On-site cleaning gas generation for process chamber cleaning Grant 6,981,508 - Shang , et al. January 3, 2	2006-01-03
Method and apparatus for electrostatically maintaining substrate flatness App 20050272273 - Shang, Quanyuan ; et al.	2005-12-08
Method and apparatus for electrostatically maintaining substrate flatness Grant 6,902,682 - Shang , et al. June 7, 2	2005-06-07
Optical Integrated Circuits (ics) App 20050115921 - Mak, Cecilia Y. ; et al.	2005-06-02
Methods to form metal lines using selective electrochemical deposition Grant 6,887,776 - Shang , et al. May 3, 2	2005-05-03
Fluorine process for cleaning semiconductor process chamber Grant 6,880,561 - Goto , et al. April 19, 2	2005-04-19
Method for plasma etching a dielectric layer App 20050048789 - Merry, Walter R. ; et al.	2005-03-03
Multiple frequency plasma chamber with grounding capacitor at cathode Grant 6,857,387 - Sun , et al. February 22, 2	2005-02-22
On-site cleaning gas generation for process chamber cleaning Grant 6,843,258 - Shang , et al. January 18, 2	2005-01-18
Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flow Grant 6,825,134 - Law , et al. November 30, 2	2004-11-30
On-site cleaning gas generation for process chamber cleaning App 20040216768 - Shang, Quanyuan ; et al.	2004-11-04
Methods To Form Metal Lines Using Selective Electrochemical Deposition App 20040203181 - Shang, Quanyuan ; et al.	2004-10-14
Method and apparatus for metallization of large area substrates App 20040058067 - Law, Kam S. ; et al.	2004-03-25
Pre-polycoating of glass substrates App 20030219540 - Law, Kam S. ; et al.	2003-11-27
Plasma display panel with a low k dielectric layer App 20030218424 - Law, Kam S. ; et al.	2003-11-27
Surface-treated shower head for use in a substrate processing chamber Grant 6,647,993 - Shang , et al. November 18, 2	2003-11-18
Fluorine process for cleaning semiconductor process chamber App 20030192569 - Goto, Haruhiro Harry ; et al.	2003-10-16
Deposition of film layers App 20030186561 - Law, Kam S. ; et al.	2003-10-02
Plasma display panel with a low k dielectric layer Grant 6,610,354 - Law , et al. August 26, 2	2003-08-26
Method and apparatus for substrate processing App 20030141820 - White, John M. ; et al.	2003-07-31
Selectively etching silicon using fluorine without plasma App 20030109144 - Goto, Haruhiro Harry ; et al.	2003-06-12
Method and apparatus for electrostatically maintaining substrate flatness App 20030070616 - Shang, Quanyuan ; et al.	2003-04-17
Method and apparatus for enhanced chamber cleaning App 20030066541 - Sun, Sheng ; et al.	2003-04-10
Fluorine Process For Cleaning Semiconductor Process Chamber App 20030010354 - GOTO , HARUHIRO HARRY ; et al.	2003-01-16
Selectively etching silicon using fluorine without plasma Grant 6,500,356 - Goto , et al. December 31, 2	2002-12-31
Deposition of TEOS oxide using pulsed RF plasma App 20020192475 - Goto, Haruhiro H. ; et al.	2002-12-19
Plasma display panel with a low k dielectric layer App 20020190651 - Law, Kam S. ; et al.	2002-12-19
Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology Grant 6,468,601 - Shang , et al. October 22, 2	2002-10-22
Selectively Etching Silicon Using Fluorine Without Plasma App 20020134755 - GOTO , HARUHIRO HARRY ; et al.	2002-09-26
Deposition of TEOS oxide using pulsed RF plasma Grant 6,451,390 - Goto , et al. September 17, 2	2002-09-17
Method for depositing amorphous silicon thin films onto large area glass substrates by chemical vapor deposition at high deposition rates Grant 6,444,277 - Law , et al. September 3, 2	2002-09-03
On-site cleaning gas generation for process chamber cleaning App 20020074013 - Shang, Quanyuan ; et al.	2002-06-20
Method And Apparatus For Enhanced Chamber Cleaning App 20020033183 - SUN, SHENG ; et al.	2002-03-21
Surface-treated shower head for use in a substrate processing chamber App 20010006070 - Shang, Quanyuan ; et al.	2001-07-05
Modular substrate processing system Grant 6,235,634 - White , et al. May 22, 2	2001-05-22
Surface-treated shower head for use in a substrate processing chamber Grant 6,182,603 - Shang , et al. February 6, 2	2001-02-06
Annealing an amorphous film using microwave energy Grant 6,172,322 - Shang , et al. January 9, 2	2001-01-09
Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process Grant 6,167,834 - Wang , et al. January 2, 2	2001-01-02
Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology Grant 6,055,927 - Shang , et al. May 2, 2	2000-05-02
Process for PECVD of silicon oxide using TEOS decomposition Grant RE36,623 - Wang , et al. March 21, 2	2000-03-21
Dual frequency excitation of plasma for film deposition Grant 6,024,044 - Law , et al. February 15, 2	2000-02-15
Tapered dielectric etch in semiconductor devices Grant 5,895,937 - Su , et al. April 20, 1	1999-04-20
High power microwave plasma applicator Grant 5,895,548 - Ettinger , et al. April 20, 1	1999-04-20
Method for protecting against deposition on a selected region of a substrate Grant 5,871,811 - Wang , et al. February 16, 1	1999-02-16
Dry-etch of indium and tin oxides with C2H5I gas Grant 5,843,277 - Goto , et al. December 1, 1	1998-12-01
Deposition chamber cleaning technique using a high power remote excitation source Grant 5,788,778 - Shang , et al. August 4, 1	1998-08-04
Method and apparatus for etching film layers on large substrates Grant 5,753,133 - Wong , et al. May 19, 1	1998-05-19
High-rate dry-etch of indium and tin oxides by hydrogen and halogen radicals such as derived from HCl gas Grant 5,607,602 - Su , et al. March 4, 1	1997-03-04
Multi-step chemical vapor deposition method for thin film transistors Grant 5,441,768 - Law , et al. August 15, 1	1995-08-15
Plasma CVD of silicon nitride thin films on large area glass substrates at high deposition rates Grant 5,399,387 - Law , et al. March 21, 1	1995-03-21
Method and apparatus for protection of conductive surfaces in a plasma processing reactor Grant 5,366,585 - Robertson , et al. November 22, 1	1994-11-22
Plasma-enhanced CVD process using TEOS for depositing silicon oxide Grant 5,362,526 - Wang , et al. * November 8, 1	1994-11-08
Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process Grant 5,354,715 - Wang , et al. * October 11, 1	1994-10-11
Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing Grant 5,244,841 - Marks , et al. * September 14, 1	1993-09-14
Method for planarizing an integrated circuit structure using low melting inorganic material Grant 5,204,288 - Marks , et al. April 20, 1	1993-04-20
Method for planarizing an integrated circuit structure using low melting inorganic material and flowing while depositing Grant 5,112,776 - Marks , et al. * May 12, 1	1992-05-12
Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process Grant 5,000,113 - Wang , et al. March 19, 1	1991-03-19
Reactor chamber self-cleaning process Grant 4,960,488 - Law , et al. October 2, 1	1990-10-02
Process for PECVD of silicon oxide using TEOS decomposition Grant 4,892,753 - Wang , et al. January 9, 1	1990-01-09
CVD of silicon oxide using TEOS decomposition and in-situ planarization process Grant 4,872,947 - Wang , et al. October 10, 1	1989-10-10

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