Laville; Arnaud
Patent Applications and Registrations
Patent applications and USPTO patent grants for Laville; Arnaud.The latest application filed is for "stacked die assembly".
- Laville; Arnaud - Neuchatel CH
- LAVILLE; Arnaud - Bevaix CH
| Patent | Date |
|---|---|
| Stray field rejection in magnetic sensors Grant 11,435,413 - Close , et al. September 6, 2 | 2022-09-06 |
| Stacked Die Assembly App 20210111335 - LAVILLE; Arnaud ; et al. | 2021-04-15 |
| Magnetic Sensor Component And Assembly App 20210018574 - CHEN; Jian ; et al. | 2021-01-21 |
| Stray Field Rejection In Magnetic Sensors App 20200408853 - CLOSE; Gael ; et al. | 2020-12-31 |
| Stray field rejection in magnetic sensors Grant 10,809,314 - Close , et al. October 20, 2 | 2020-10-20 |
| Stray Field Rejection In Magnetic Sensors App 20190079142 - CLOSE; Gael ; et al. | 2019-03-14 |
| Stress sensor for measuring mechanical stresses in a semiconductor chip and stress compensated hall sensor Grant 9,016,135 - Huber , et al. April 28, 2 | 2015-04-28 |
| Magnetic angle sensor Grant 8,664,945 - Laville , et al. March 4, 2 | 2014-03-04 |
| Stress Sensor For Measuring Mechanical Stresses In A Semiconductor Chip And Stress Compensated Hall Sensor App 20120210800 - Huber; Samuel ; et al. | 2012-08-23 |
| Magnetic Angle Sensor App 20120001620 - Laville; Arnaud ; et al. | 2012-01-05 |
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