Lauro; Paul Alfred

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lauro; Paul Alfred.The latest application filed is for "singulating individual chips from wafers having small chips and small separation channels".

Company Profile

2.46.81

Lauro; Paul Alfred - Brewster NY
Lauro; Paul Alfred - Nanuet NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Singulating Individual Chips From Wafers Having Small Chips And Small Separation Channels App 20220157657 - Cabral, JR.; Cyril ; et al.	2022-05-19
Combination polyimide decal with a rigid mold Grant 11,270,966 - Nah , et al. March 8, 2	2022-03-08
Continuous solder transfer to substrates Grant 11,110,534 - Nah , et al. September 7, 2	2021-09-07
Ultrasonic-assisted Solder Transfer App 20210229203 - Nah; Jae-Woong ; et al.	2021-07-29
Combination Polyimide Decal With A Rigid Mold App 20210151402 - Nah; Jae-Woong ; et al.	2021-05-20
Continuous Solder Transfer To Substrates App 20200316702 - Nah; Jae-Woong ; et al.	2020-10-08
Coaxial probe structure of elongated electrical conductors projecting from a support structure Grant 9,404,942 - Beaman , et al. August 2, 2	2016-08-02
Redox Method Of Forming A Coaxial Probe Structure Of Elongated Electrical Conductors Projecting From A Support Structure App 20140191775 - Beaman; Brian Samuel ; et al.	2014-07-10
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof Grant 8,754,666 - Beaman , et al. June 17, 2	2014-06-17
Forming metal preforms and metal balls Grant 8,561,880 - Gruber , et al. October 22, 2	2013-10-22
Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure Grant 8,491,772 - Beaman , et al. July 23, 2	2013-07-23
Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface Grant 8,486,250 - Beaman , et al. July 16, 2	2013-07-16
Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Grant 8,241,957 - Hougham , et al. August 14, 2	2012-08-14
Method and apparatus for forming planar alloy deposits on a substrate Grant 7,906,420 - Gruber , et al. March 15, 2	2011-03-15
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging App 20110034047 - HOUGHAM; Gareth Geoffrey ; et al.	2011-02-10
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging Grant 7,883,919 - Hougham , et al. February 8, 2	2011-02-08
Method and apparatus for forming planar alloy deposits on a substrate Grant 7,867,842 - Gruber , et al. January 11, 2	2011-01-11
Method and Apparatus for Forming Planar Alloy Deposits on a Substrate App 20100072263 - Gruber; Peter Alfred ; et al.	2010-03-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100052715 - Beaman; Brian Samuel ; et al.	2010-03-04
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045266 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045318 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045324 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045317 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045320 - Beaman; Brian Samuel ; et al.	2010-02-25
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20100045321 - Beaman; Brian Samuel ; et al.	2010-02-25
Method and Apparatus for Forming Planar Alloy Deposits on a Substrate App 20100028612 - Gruber; Peter Alfred ; et al.	2010-02-04
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20090315579 - Beaman; Brian Samuel ; et al.	2009-12-24
Probe Structure Coaxial Elongated Electrical Conductor Projecting From A Support Surface, Apparatus For Use Thereof And Methods Of Fabrication Thereof App 20090308756 - Beaman; Brian Samuel ; et al.	2009-12-17
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Compsites and Conductive Elastomer Interconnects in Microelectronic Packaging App 20090263991 - Hougham; Gareth Geoffrey ; et al.	2009-10-22
Angled Flying Lead Wire Bonding Process App 20090189288 - Beaman; Brian Samuel ; et al.	2009-07-30
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Grant 7,556,979 - Hougham , et al. July 7, 2	2009-07-07
High density integrated circuit apparatus, test probe and methods of use thereof Grant 7,538,565 - Beaman , et al. May 26, 2	2009-05-26
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20090128176 - Beaman; Brian Samuel ; et al.	2009-05-21
Angled flying lead wire bonding process Grant 7,495,342 - Beaman , et al. February 24, 2	2009-02-24
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Grant 7,417,315 - Hougham , et al. August 26, 2	2008-08-26
Probe Structure Having A Plurality Of Discrete Insulated Probe Tips Projecting From A Support Surface, Apparatus For Use Thereof And Methods Of Fabrication Thereof App 20080164896 - Beaman; Brian Samuel ; et al.	2008-07-10
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080129320 - Beaman; Brian Samuel ; et al.	2008-06-05
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080129319 - Beaman; Brian Samuel ; et al.	2008-06-05
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080132094 - Beaman; Brian Samuel ; et al.	2008-06-05
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080121879 - Beaman; Brian Samuel ; et al.	2008-05-29
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080123310 - Beaman; Brian Samuel ; et al.	2008-05-29
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080117613 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080117612 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116916 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080117611 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116915 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116914 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116912 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080116913 - Beaman; Brian Samuel ; et al.	2008-05-22
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080111568 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080111569 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112147 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080111570 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112148 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112149 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112146 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112145 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080112144 - Beaman; Brian Samuel ; et al.	2008-05-15
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106283 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106281 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106285 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106872 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106284 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106291 - Beaman; Brian Samuel ; et al.	2008-05-08
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080106282 - Beaman; Brian Samuel ; et al.	2008-05-08
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof Grant 7,368,924 - Beaman , et al. May 6, 2	2008-05-06
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100317 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100318 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100316 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080100324 - Beaman; Brian Samuel ; et al.	2008-05-01
High Density Cantilevered Probe For Electronic Devices App 20080088332 - Beaman; Brian Samuel ; et al.	2008-04-17
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080048691 - Beaman; Brian Samuel ; et al.	2008-02-28
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080048690 - Beaman; Brian Samuel ; et al.	2008-02-28
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080048697 - Beaman; Brian Samuel ; et al.	2008-02-28
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging App 20080048305 - Hougham; Gareth Geoffrey ; et al.	2008-02-28
High Density Integrated Circuit Apparatus, Test Probe And Methods Of Use Thereof App 20080047741 - Beaman; Brian Samuel ; et al.	2008-02-28
Method for fabricating a structure for making contact with a device Grant 7,332,922 - Beaman , et al. February 19, 2	2008-02-19
High Density Cantilevered Probe For Electronic Devices App 20080030215 - Beaman; Brian Samuel ; et al.	2008-02-07
High Density Cantilevered Probe For Electronic Devices App 20080024154 - Beaman; Brian Samuel ; et al.	2008-01-31
High Density Cantilevered Probe For Electronic Devices App 20080024155 - Beaman; Brian Samuel ; et al.	2008-01-31
High density integrated circuit apparatus, test probe and methods of use thereof App 20070271781 - Beaman; Brian Samuel ; et al.	2007-11-29
Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof Grant 7,282,945 - Beaman , et al. October 16, 2	2007-10-16
High density integral test probe Grant 7,276,919 - Beaman , et al. October 2, 2	2007-10-02
High density cantilevered probe for electronic devices App 20050179456 - Beaman, Brian Samuel ; et al.	2005-08-18
Plated probe structure Grant 6,891,360 - Beaman , et al. May 10, 2	2005-05-10
Method for fabricating a structure for making contact with an IC device Grant 6,880,245 - Beaman , et al. April 19, 2	2005-04-19
High density integrated circuit apparatus, test probe and methods of use thereof App 20050062492 - Beaman, Brian Samuel ; et al.	2005-03-24
Angled flying lead wire bonding process App 20040148773 - Beaman, Brian Samuel ; et al.	2004-08-05
Compliant interposer assembly for wafer test and "burn-in" operations App 20040135594 - Beaman, Brian Samuel ; et al.	2004-07-15
High density cantilevered probe for electronic devices App 20040130343 - Beaman, Brian Samuel ; et al.	2004-07-08
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging App 20040110322 - Hougham, Gareth Geoffrey ; et al.	2004-06-10
Method of forming a structure for electronic devices contact locations Grant 6,722,032 - Beaman , et al. April 20, 2	2004-04-20
Angled flying lead wire bonding process Grant 6,708,403 - Beaman , et al. March 23, 2	2004-03-23
Angled flying lead wire bonding process App 20030106213 - Beaman, Brian Samuel ; et al.	2003-06-12
Structural design and processes to control probe position accuracy in a wafer test probe assembly App 20030048108 - Beaman, Brian Samuel ; et al.	2003-03-13
Angled flying lead wire bonding process Grant 6,526,655 - Beaman , et al. March 4, 2	2003-03-04
Integrated compliant probe for wafer level test and burn-in Grant 6,528,984 - Beaman , et al. March 4, 2	2003-03-04
Probe structures for testing electrical interconnections to integrated circuit electronic devices Grant 6,525,551 - Beaman , et al. February 25, 2	2003-02-25
Process and structure to repair damaged probes mounted on a space transformer Grant 6,523,255 - Shih , et al. February 25, 2	2003-02-25
Process and structure to repair damaged probes mounted on a space transformer App 20020194730 - Shih, Da-Yuan ; et al.	2002-12-26
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof App 20020190738 - Beaman, Brian Samuel ; et al.	2002-12-19
Integrated Compliant Probe For Wafer Level Test And Burn-in App 20020130676 - BEAMAN, BRIAN SAMUEL ; et al.	2002-09-19
Probe structure having a plurality of discrete insulated probe tips Grant 6,452,406 - Beaman , et al. September 17, 2	2002-09-17
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof App 20020089344 - Beaman, Brian Samuel ; et al.	2002-07-11
High density integrated circuit apparatus, test probe and methods of use thereof App 20020014004 - Beaman, Brian Samuel ; et al.	2002-02-07
High density integral test probe and fabrication method App 20020011001 - Beaman, Brian Samuel ; et al.	2002-01-31
High density integrated circuit apparatus, test probe and methods of use thereof Grant 6,334,247 - Beaman , et al. January 1, 2	2002-01-01
High density cantilevered probe for electronic devices App 20010054907 - Beaman, Brian Samuel ; et al.	2001-12-27
Method of making high density integral test probe Grant 6,332,270 - Beaman , et al. December 25, 2	2001-12-25
High density cantilevered probe for electronic devices Grant 6,329,827 - Beaman , et al. December 11, 2	2001-12-11
Angled flying lead wire bonding process App 20010045012 - Beaman, Brian Samuel ; et al.	2001-11-29
Method Of Making A High Density Integral Test Probe App 20010040460 - BEAMAN, BRIAN SAMUEL ; et al.	2001-11-15
High density integrated circuit apparatus, test probe and methods of use thereof Grant 6,300,780 - Beaman , et al. October 9, 2	2001-10-09
Angled flying lead wire bonding process Grant 6,295,729 - Beaman , et al. October 2, 2	2001-10-02
Structures and processes to create a desired probetip contact geometry on a wafer test probe Grant 6,206,273 - Beaman , et al. March 27, 2	2001-03-27
Pluggable chip scale package Grant 6,078,500 - Beaman , et al. June 20, 2	2000-06-20
High density test probe with rigid surface structure Grant 6,062,879 - Beaman , et al. May 16, 2	2000-05-16
Foamed elastomers for wafer probing applications and interposer connectors Grant 6,054,651 - Fogel , et al. April 25, 2	2000-04-25
High density cantilevered probe for electronic devices Grant 5,914,614 - Beaman , et al. June 22, 1	1999-06-22
Integral rigid chip test probe Grant 5,838,160 - Beaman , et al. November 17, 1	1998-11-17
Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof Grant 5,821,763 - Beaman , et al. October 13, 1	1998-10-13
High density cantilevered probe for electronic devices Grant 5,811,982 - Beaman , et al. September 22, 1	1998-09-22
High density test probe with rigid surface structure Grant 5,785,538 - Beaman , et al. July 28, 1	1998-07-28