Lauro; Paul A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lauro; Paul A..The latest application filed is for "low-profile battery construct with engineered interfaces".

Company Profile

6.89.89

Lauro; Paul A. - Brewster NY
Lauro; Paul A. - Armonk NY US
Lauro; Paul A. - Yorktown Heights NY
Lauro; Paul A - Brewster NY
Lauro; Paul A. - Browster NY
Lauro; Paul A. - Nanuet NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low-profile battery construct with engineered interfaces Grant 11,183,725 - Andry , et al. November 23, 2	2021-11-23
Method of making a gallium nitride device Grant 10,892,333 - Bedell , et al. January 12, 2	2021-01-12
Low-profile Battery Construct With Engineered Interfaces App 20200144564 - Andry; Paul S. ; et al.	2020-05-07
Low-profile battery construct with engineered interfaces Grant 10,581,037 - Andry , et al.	2020-03-03
Method Of Making A Gallium Nitride Device App 20190296113 - Bedell; Stephen W. ; et al.	2019-09-26
Method of making a gallium nitride device Grant 10,424,644 - Bedell , et al. Sept	2019-09-24
Protective capping layer for spalled gallium nitride Grant 10,249,792 - Bedell , et al.	2019-04-02
Direct injection molded solder process for forming solder bumps on wafers Grant 10,147,694 - Dang , et al. De	2018-12-04
Method for improving quality of spalled material layers Grant 10,026,618 - Bedell , et al. July 17, 2	2018-07-17
Simplified process for vertical LED manufacturing Grant 10,020,418 - Bedell , et al. July 10, 2	2018-07-10
Protective capping layer for spalled gallium nitride Grant 9,929,313 - Bedell , et al. March 27, 2	2018-03-27
Patterned metallization handle layer for controlled spalling Grant 9,918,382 - Al-Saud , et al. March 13, 2	2018-03-13
Protective Capping Layer For Spalled Gallium Nitride App 20180047875 - Bedell; Stephen W. ; et al.	2018-02-15
Patterned Metallization Handle Layer For Controlled Spalling App 20170311436 - Al-Saud; Turki bin Saud bin Mohammed ; et al.	2017-10-26
Method Of Making A Gallium Nitride Device App 20170294517 - Bedell; Stephen W. ; et al.	2017-10-12
Low-profile Battery Construct With Engineered Interfaces App 20170256759 - Andry; Paul S. ; et al.	2017-09-07
Method of making a gallium nitride device Grant 9,748,353 - Bedell , et al. August 29, 2	2017-08-29
Protective Capping Layer For Spalled Gallium Nitride App 20170222090 - Bedell; Stephen W. ; et al.	2017-08-03
Fabricating high-power devices Grant 9,722,039 - Bedell , et al. August 1, 2	2017-08-01
Patterned metallization handle layer for controlled spalling Grant 9,713,250 - Al-Saud , et al. July 18, 2	2017-07-18
Fabricating High-power Devices App 20170194456 - Bedell; Stephen W. ; et al.	2017-07-06
Method Of Making A Gallium Nitride Device App 20170194449 - Bedell; Stephen W. ; et al.	2017-07-06
Method For Improving Quality Of Spalled Material Layers App 20170148635 - Bedell; Stephen W. ; et al.	2017-05-25
Patterned metallization handle layer for controlled spalling Grant 9,578,736 - Al-Saud , et al. February 21, 2	2017-02-21
Protective capping layer for spalled gallium nitride Grant 9,570,295 - Bedell , et al. February 14, 2	2017-02-14
Method for improving quality of spalled material layers Grant 9,564,335 - Bedell , et al. February 7, 2	2017-02-07
Simplified process for vertical LED manufacturing Grant 9,502,609 - Bedell , et al. November 22, 2	2016-11-22
Substrate holder assembly for controlled layer transfer Grant 9,502,278 - Bedell , et al. November 22, 2	2016-11-22
Simplified Process for Vertical LED Manufacturing App 20160284928 - Bedell; Stephen W. ; et al.	2016-09-29
Simplified Process for Vertical LED Manufacturing App 20160284954 - Bedell; Stephen W. ; et al.	2016-09-29
Controlled spalling of fine features Grant 9,455,180 - Bedell , et al. September 27, 2	2016-09-27
Patterned Metallization Handle Layer For Controlled Spalling App 20160183362 - Al-Saud; Turki bin Saud bin Mohammed ; et al.	2016-06-23
Patterned Metallization Handle Layer For Controlled Spalling App 20160183358 - Al-Saud; Turki bin Saud bin Mohammed ; et al.	2016-06-23
Method For Improving Quality Of Spalled Material Layers App 20160163553 - Bedell; Stephen W. ; et al.	2016-06-09
Direct Injection Molded Solder Process For Forming Solder Bumps On Wafers App 20160118358 - Dang; Bing ; et al.	2016-04-28
Method for improving surface quality of spalled substrates Grant 9,308,714 - Bedell , et al. April 12, 2	2016-04-12
Double solder bumps on substrates for low temperature flip chip bonding Grant 9,295,166 - Gruber , et al. March 22, 2	2016-03-22
Direct injection molded solder process for forming solder bumps on wafers Grant 9,273,408 - Dang , et al. March 1, 2	2016-03-01
Method for improving quality of spalled material layers Grant 9,275,867 - Bedell , et al. March 1, 2	2016-03-01
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 9,263,363 - Hougham , et al. February 16, 2	2016-02-16
Double solder bumps on substrates for low temperature flip chip bonding Grant 9,095,081 - Gruber , et al. July 28, 2	2015-07-28
Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip Grant 9,082,762 - Kang , et al. July 14, 2	2015-07-14
Double Solder Bumps On Substrates For Low Temperature Flip Chip Bonding App 20150195920 - Gruber; Peter A. ; et al.	2015-07-09
Double Solder Bumps On Substrates For Low Temperature Flip Chip Bonding App 20150194408 - Gruber; Peter A. ; et al.	2015-07-09
Method for facilitating crack initiation during controlled substrate spalling Grant 9,040,432 - Bedell , et al. May 26, 2	2015-05-26
Method For Improving Quality Of Spalled Material Layers App 20150140830 - Bedell; Stephen W. ; et al.	2015-05-21
Double solder bumps on substrates for low temperature flip chip bonding Grant 8,987,132 - Gruber , et al. March 24, 2	2015-03-24
Fixed curvature force loading of mechanically spalled films Grant 8,969,174 - Bedell , et al. March 3, 2	2015-03-03
Forming metal preforms and metal balls Grant 8,944,306 - Gruber , et al. February 3, 2	2015-02-03
Removal of stressor layer from a spalled layer and method of making a bifacial solar cell using the same Grant 8,936,961 - Bedell , et al. January 20, 2	2015-01-20
Method for improving quality of spalled material layers Grant 8,916,450 - Bedell , et al. December 23, 2	2014-12-23
Double Solder Bumps On Substrates For Low Temperature Flip Chip Bonding App 20140363965 - Gruber; Peter A. ; et al.	2014-12-11
Substrate Holder Assembly For Controlled Layer Transfer App 20140312576 - Bedell; Stephen W. ; et al.	2014-10-23
Substrate Holder Assembly For Controlled Layer Transfer App 20140312094 - Bedell; Stephen W. ; et al.	2014-10-23
Method for forming two device wafers from a single base substrate utilizing a controlled spalling process Grant 8,841,203 - Bedell , et al. September 23, 2	2014-09-23
Forming an array of metal balls or shapes on a substrate Grant 8,833,636 - Gruber , et al. September 16, 2	2014-09-16
Method For Improving Surface Quality Of Spalled Substrates App 20140251548 - Bedell; Stephen W. ; et al.	2014-09-11
Double solder bumps on substrates for low temperature flip chip bonding Grant 8,828,860 - Gruber , et al. September 9, 2	2014-09-09
Method For Facilitating Crack Initiation During Controlled Substrate Spalling App 20140242807 - Bedell; Stephen W. ; et al.	2014-08-28
Edge-exclusion spalling method for improving substrate reusability Grant 8,748,296 - Bedell , et al. June 10, 2	2014-06-10
Fixed Curvature Force Loading Of Mechanically Spalled Films App 20140147988 - Bedell; Stephen W. ; et al.	2014-05-29
Spalling utilizing stressor layer portions Grant 8,709,957 - Bedell , et al. April 29, 2	2014-04-29
Method for controlled layer transfer Grant 8,709,914 - Bedell , et al. April 29, 2	2014-04-29
Forming An Array Of Metal Balls Or Shapes On A Substrate App 20140110462 - GRUBER; PETER A. ; et al.	2014-04-24
Fixed curvature force loading of mechanically spalled films Grant 8,679,943 - Bedell , et al. March 25, 2	2014-03-25
Direct Injection Molded Solder Process For Forming Solder Bumps On Wafers App 20140069817 - Dang; Bing ; et al.	2014-03-13
Double Solder Bumps On Substrates For Low Temperature Flip Chip Bonding App 20140065771 - Gruber; Peter A. ; et al.	2014-03-06
Forming Metal Preforms And Metal Balls App 20140041824 - GRUBER; PETER A. ; et al.	2014-02-13
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive App 20140038362 - Hougham; Gareth ; et al.	2014-02-06
Method For Improving Quality Of Spalled Material Layers App 20140034699 - Bedell; Stephen W. ; et al.	2014-02-06
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 8,604,623 - Hougham , et al. December 10, 2	2013-12-10
Removal Of Stressor Layer From A Spalled Layer And Method Of Making A Bifacial Solar Cell Using The Same App 20130312819 - Bedell; Stephen W. ; et al.	2013-11-28
Removal Of Stressor Layer From A Spalled Layer And Method Of Making A Bifacial Solar Cell Using The Same App 20130316488 - Bedell; Stephen W. ; et al.	2013-11-28
Spalling Utilizing Stressor Layer Portions App 20130316542 - Bedell; Stephen W. ; et al.	2013-11-28
Forming an array of metal balls or shapes on a substrate Grant 8,523,046 - Gruber , et al. September 3, 2	2013-09-03
Forming Metal Preforms And Metal Balls App 20130206351 - GRUBER; PETER A. ; et al.	2013-08-15
Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates Grant 8,492,262 - Gruber , et al. July 23, 2	2013-07-23
Thin substrate fabrication using stress-induced spalling Grant 8,450,184 - Bedell , et al. May 28, 2	2013-05-28
Preformed Textured Semiconductor Layer App 20130082357 - Alhomoudi; Ibrahim ; et al.	2013-04-04
Fixed Curvature Force Loading Of Mechanically Spalled Films App 20130052798 - Bedell; Stephen W. ; et al.	2013-02-28
Injection molded solder method for forming solder bumps on substrates Grant 8,381,962 - Gruber , et al. February 26, 2	2013-02-26
Micro-fluidic injection molded solder (IMS) Grant 8,376,207 - Buchwalter , et al. February 19, 2	2013-02-19
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20130016479 - Hougham; Gareth ; et al.	2013-01-17
Edge-exclusion Spalling Method For Improving Substrate Reusability App 20130005116 - Bedell; Stephen W. ; et al.	2013-01-03
Method For Forming Two Device Wafers From A Single Base Substrate Utilizing A Controlled Spalling Process App 20120322230 - Bedell; Stephen W. ; et al.	2012-12-20
Method For Controlled Layer Transfer App 20120322227 - Bedell; Stephen W. ; et al.	2012-12-20
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Grant 8,314,500 - Belanger , et al. November 20, 2	2012-11-20
Thin Substrate Fabrication Using Stress-Induced Spalling App 20120282782 - Bedell; Stephen W. ; et al.	2012-11-08
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 8,268,282 - Hougham , et al. September 18, 2	2012-09-18
Method for Imparting a Controlled Amount of Stress in Semiconductor Devices for Fabricating Thin Flexible Circuits App 20120217622 - Bedell; Stephen W. ; et al.	2012-08-30
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20120211159 - Hougham; Gareth ; et al.	2012-08-23
Thin substrate fabrication using stress-induced substrate spalling Grant 8,247,261 - Bedell , et al. August 21, 2	2012-08-21
Micro-Fluidic Injection Molded Solder (IMS) App 20120132694 - Buchwalter; Stephen L. ; et al.	2012-05-31
Micro-fluidic injection molded solder (IMS) Grant 8,162,200 - Buchwalter , et al. April 24, 2	2012-04-24
Patterned metal thermal interface Grant 8,156,998 - Furman , et al. April 17, 2	2012-04-17
Micro-fluidic injection molded solder (IMS) Grant 8,136,714 - Buchwalter , et al. March 20, 2	2012-03-20
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20120012642 - Fogel; Keith E. ; et al.	2012-01-19
Hybrid Liquid Metal-solder Thermal Interface App 20110240279 - Furman; BRUCE K. ; et al.	2011-10-06
Micro-Fluidic Injection Molded Solder (IMS) App 20110233262 - Buchwalter; Stephen L. ; et al.	2011-09-29
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Grant 8,026,613 - Fogel , et al. September 27, 2	2011-09-27
Structure of UBM and solder bumps and methods of fabrication Grant 8,003,512 - Belanger , et al. August 23, 2	2011-08-23
Direct IMS (Injection Molded Solder) Without a Mask for Forming Solder Bumps on Substrates App 20110201194 - Gruber; Peter A. ; et al.	2011-08-18
Micro-Fluidic Injection Molded Solder (IMS) App 20110192887 - Buchwalter; Stephen L. ; et al.	2011-08-11
Micro-fluidic injection molded solder (IMS) Grant 7,980,446 - Buchwalter , et al. July 19, 2	2011-07-19
Cooling apparatus with cold plate formed in situ on a surface to be cooled Grant 7,978,473 - Campbell , et al. July 12, 2	2011-07-12
Electromigration-resistant Under-bump Metallization Of Nickel-iron Alloys For Sn-rich Solder Bumps Of Pb-free Flip-chip Applications App 20110156256 - Kang; Sung K. ; et al.	2011-06-30
Injection Molded Solder Method for Forming Solder Bumps on Substrates App 20110127312 - Gruber; Peter A. ; et al.	2011-06-02
Injection molded solder method for forming solder bumps on substrates Grant 7,931,187 - Gruber , et al. April 26, 2	2011-04-26
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Grant 7,932,169 - Belanger , et al. April 26, 2	2011-04-26
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Grant 7,923,849 - Fogel , et al. April 12, 2	2011-04-12
Structure and methods of processing for solder thermal interface materials for chip cooling Grant 7,898,076 - Furman , et al. March 1, 2	2011-03-01
Thin Substrate Fabrication Using Stress-induced Substrate Spalling App 20100311250 - Bedell; Stephen W. ; et al.	2010-12-09
Spalling for a Semiconductor Substrate App 20100310775 - Bedell; Stephen W. ; et al.	2010-12-09
Method for fabricating electrical contact buttons Grant 7,823,278 - Hougham , et al. November 2, 2	2010-11-02
Micro-fluidic Injection Molded Solder (ims) App 20100224670 - Buchwalter; Stephen L. ; et al.	2010-09-09
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive Adhesive App 20100207056 - Hougham; Gareth ; et al.	2010-08-19
Novel Structure Of Ubm And Solder Bumps And Methods Of Fabrication App 20100193949 - Belanger; Luc L. ; et al.	2010-08-05
Patterned Metal Thermal Interface App 20100147497 - FURMAN; BRUCE K. ; et al.	2010-06-17
Land grid array fabrication using elastomer core and conducting metal shell or mesh Grant 7,736,152 - Hougham , et al. June 15, 2	2010-06-15
Cooling Apparatus With Cold Plate Formed In Situ On A Surface To Be Cooled App 20100142150 - CAMPBELL; Levi A. ; et al.	2010-06-10
Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled Grant 7,731,079 - Campbell , et al. June 8, 2	2010-06-08
Injection Molded Solder Method For Forming Solder Bumps On Substrates App 20100116871 - Gruber; Peter A. ; et al.	2010-05-13
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 7,708,909 - Hougham , et al. May 4, 2	2010-05-04
Patterned metal thermal interface Grant 7,694,719 - Furman , et al. April 13, 2	2010-04-13
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers App 20100062597 - Belanger; Luc ; et al.	2010-03-11
Interposer with electrical contact button and method Grant 7,648,369 - Hougham , et al. January 19, 2	2010-01-19
Cooling Apparatus And Method Of Fabrication Thereof With A Cold Plate Formed In Situ On A Surface To Be Cooled App 20090316360 - CAMPBELL; Levi A. ; et al.	2009-12-24
Solder interconnect structure and method using injection molded solder Grant 7,523,852 - Buchwalter , et al. April 28, 2	2009-04-28
Interposer with Electrical Contact Button and Method App 20090044405 - Hougham; Gareth G. ; et al.	2009-02-19
Land Grid Array Fabrication Using Elastomer Core And Conducting Metal Shell Or Mesh App 20090042414 - Hougham; Gareth G. ; et al.	2009-02-12
Land grid array fabrication using elastomer core and conducting metal shell or mesh Grant 7,479,014 - Hougham , et al. January 20, 2	2009-01-20
Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling App 20080265404 - Furman; Bruce ; et al.	2008-10-30
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20080203585 - Fogel; Keith E. ; et al.	2008-08-28
Self Orienting Micro Plates Of Thermally Conducting Material As Component In Thermal Paste Or Adhesive App 20080202386 - Hougham; Gareth ; et al.	2008-08-28
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20080206979 - Fogel; Keith E. ; et al.	2008-08-28
Interconnections For Flip-chip Using Lead-free Solders And Having Reaction Barrier Layers App 20080202792 - Fogel; Keith E. ; et al.	2008-08-28
Interconnections for flip-chip using lead-free solders and having reaction barrier layers Grant 7,410,833 - Fogel , et al. August 12, 2	2008-08-12
Patterned Metal Thermal Interface App 20080165502 - Furman; Bruce K. ; et al.	2008-07-10
Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers App 20080157395 - Belanger; Luc ; et al.	2008-07-03
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Grant 7,351,360 - Hougham , et al. April 1, 2	2008-04-01
Interposer With Electrical Contact Button And Method App 20070087588 - Hougham; Gareth G. ; et al.	2007-04-19
Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof Grant 7,172,431 - Beaman , et al. February 6, 2	2007-02-06
Interposer with electrical contact button and method Grant 7,137,827 - Hougham , et al. November 21, 2	2006-11-21
Solder interconnect structure and method using injection molded solder App 20060118604 - Buchwalter; Stephen L. ; et al.	2006-06-08
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive App 20060112857 - Hougham; Gareth ; et al.	2006-06-01
Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof App 20060046528 - Beaman; Brian S. ; et al.	2006-03-02
Interposer with electrical contact button and method App 20060009050 - Hougham; Gareth G. ; et al.	2006-01-12
Land grid array fabrication using elastomer core and conducting metal shell or mesh App 20060003648 - Hougham; Gareth G. ; et al.	2006-01-05
Interconnections for flip-chip using lead-free solders and having reaction barrier layers App 20050224966 - Fogel, Keith E. ; et al.	2005-10-13
Interposer with electrical contact button and method App 20050106902 - Hougham, Gareth G. ; et al.	2005-05-19
Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer Grant 5,635,846 - Beaman , et al. June 3, 1	1997-06-03
Method of forming a three dimensional high performance interconnection package Grant 5,531,022 - Beaman , et al. July 2, 1	1996-07-02
Three dimensional high performance interconnection package Grant 5,371,654 - Beaman , et al. December 6, 1	1994-12-06

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