Lauffer; John M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lauffer; John M..The latest application filed is for "electrically conductive adhesive (eca) for multilayer device interconnects".

Company Profile

1.101.84

Lauffer; John M. - Waverly NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrically conductive adhesive (ECA) for multilayer device interconnects Grant 9,451,693 - Das , et al. September 20, 2	2016-09-20
Substrate having internal capacitor and method of making same Grant 8,607,445 - Das , et al. December 17, 2	2013-12-17
Method of forming multilayer capacitors in a printed circuit substrate Grant 8,501,575 - Das , et al. August 6, 2	2013-08-06
Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same Grant 8,502,082 - Chan , et al. August 6, 2	2013-08-06
Electrically Conductive Adhesive (eca) For Multilayer Device Interconnects App 20130033827 - Das; Rabindra N. ; et al.	2013-02-07
Circuitized substrate with dielectric interposer assembly and method Grant 8,299,371 - Das , et al. October 30, 2	2012-10-30
Method Of Forming Multilayer Capacitors In A Printed Circuit Substrate App 20120223047 - Das; Rabindra N. ; et al.	2012-09-06
Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate Grant 8,247,703 - Das , et al. August 21, 2	2012-08-21
Method of making circuitized substrates having film resistors as part thereof Grant 8,240,027 - Egitto , et al. August 14, 2	2012-08-14
Circuitized substrates utilizing smooth-sided conductive layers as part thereof Grant 8,242,376 - Lauffer , et al. August 14, 2	2012-08-14
Circuitized Substrate With Dielectric Interposer Assembly And Method App 20120152605 - Das; Rabindra N. ; et al.	2012-06-21
Multi-layer embedded capacitance and resistance substrate core Grant 8,144,480 - Das , et al. March 27, 2	2012-03-27
Method For Making Circuitized Substrates Having Photo-imageable Dielectric Layers In A Continuous Manner App 20110173809 - Lauffer; John M. ; et al.	2011-07-21
Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Grant 7,977,034 - Lauffer , et al. July 12, 2	2011-07-12
Capacitive substrate Grant 7,897,877 - Das , et al. March 1, 2	2011-03-01
Method Of Making Circuitized Substrate With Resistor Including Material With Metal Component And Electrical Assembly And Information Handling System Utilizing Said Circuitized Substrate App 20110043987 - Das; Rabindra N. ; et al.	2011-02-24
Photosensitive dielectric film App 20110017498 - Lauffer; John M. ; et al.	2011-01-27
Method of making circuitized substrate with a resistor Grant 7,870,664 - Das , et al. January 18, 2	2011-01-18
Circuitized Substrates Utilizing Smooth-sided Conductive Layers As Part Thereof App 20100328868 - Lauffer; John M. ; et al.	2010-12-30
LED lighting assembly and lamp utilizing same Grant 7,841,741 - Chan , et al. November 30, 2	2010-11-30
Circuitized substrates utilizing smooth-sided conductive layers as part thereof Grant 7,838,776 - Lauffer , et al. November 23, 2	2010-11-23
Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Grant 7,827,682 - Lauffer , et al. November 9, 2	2010-11-09
Method of making circuitized substrate with filled isolation border Grant 7,814,649 - Lauffer , et al. October 19, 2	2010-10-19
Capacitive substrate and method of making same Grant 7,803,688 - Das , et al. September 28, 2	2010-09-28
Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same Grant 7,800,916 - Blackwell , et al. September 21, 2	2010-09-21
Multi-layer embedded capacitance and resistance substrate core Grant 7,791,897 - Das , et al. September 7, 2	2010-09-07
Multi-layer Embedded Capacitance And Resistance Substrate Core App 20100167210 - Das; Rabindra N. ; et al.	2010-07-01
Mulit-layer embedded capacitance and resistance substrate core App 20100060381 - Das; Rabindra N. ; et al.	2010-03-11
Method for making a multilayered circuitized substrate Grant 7,627,947 - Davis , et al. December 8, 2	2009-12-08
Method of improving electrical connections in circuitized substrates Grant 7,629,559 - Desai , et al. December 8, 2	2009-12-08
Circuitized substrate and method of making same App 20090241332 - Lauffer; John M. ; et al.	2009-10-01
Capacitive substrate and method of making same App 20090206051 - Das; Rabindra N. ; et al.	2009-08-20
Method of making circuitized assembly including a plurality of circuitized substrates App 20090178273 - Lauffer; John M.	2009-07-16
Method of making circuitized substrates having film resistors as part thereof App 20090178271 - Egitto; Frank D. ; et al.	2009-07-16
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Grant 7,541,265 - Das , et al. June 2, 2	2009-06-02
Method of making a printed circuit board with low cross-talk noise Grant 7,530,167 - Lauffer , et al. May 12, 2	2009-05-12
Information handling system utilizing circuitized substrate with split conductive layer Grant 7,491,896 - Lauffer , et al. February 17, 2	2009-02-17
Method of making circuitized substrate with signal wire shielding Grant 7,478,472 - Lauffer , et al. January 20, 2	2009-01-20
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate Grant 7,449,381 - Das , et al. November 11, 2	2008-11-11
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate Grant 7,442,879 - Das , et al. October 28, 2	2008-10-28
Circuitized substrates utilizing smooth-sided conductive layers as part thereof App 20080259581 - Lauffer; John M. ; et al.	2008-10-23
Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same App 20080244902 - Blackwell; Kim J. ; et al.	2008-10-09
Method of making a circuitized substrate having at least one capacitor therein App 20080248596 - Das; Rabindra N. ; et al.	2008-10-09
LED lighting assembly and lamp utilizing same App 20080238323 - Chan; Benson ; et al.	2008-10-02
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate Grant 7,429,510 - Das , et al. September 30, 2	2008-09-30
Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate App 20080151515 - Das; Rabindra N. ; et al.	2008-06-26
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof Grant 7,383,629 - Lauffer , et al. June 10, 2	2008-06-10
Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate Grant 7,384,856 - Das , et al. June 10, 2	2008-06-10
Method of making circuitized substrate Grant 7,381,587 - Japp , et al. June 3, 2	2008-06-03
Method of making circuitized substrate with split conductive layer and information handling system utilizing same Grant 7,377,033 - Lauffer , et al. May 27, 2	2008-05-27
Information handling system utilizing circuitized substrate with split conductive layer App 20080117583 - Lauffer; John M. ; et al.	2008-05-22
Method of forming printed circuit card Grant 7,353,590 - Fallon , et al. April 8, 2	2008-04-08
Method of providing printed circuit board with conductive holes and board resulting therefrom Grant 7,348,677 - Larnerd , et al. March 25, 2	2008-03-25
Method of making circuitized substrate assembly Grant 7,343,674 - Fuller, Jr. , et al. March 18, 2	2008-03-18
Circuitized substrate with increased roughness conductive layer as part thereof App 20080054476 - Egitto; Frank D. ; et al.	2008-03-06
Apparatus for making circuitized substrates in a continuous manner Grant 7,328,502 - Lauffer , et al. February 12, 2	2008-02-12
Method of making circuitized substrate with internal organic memory device Grant 7,326,643 - Desai , et al. February 5, 2	2008-02-05
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof Grant 7,307,022 - Egitto , et al. December 11, 2	2007-12-11
Capacitive substrate and method of making same App 20070275525 - Das; Rabindra N. ; et al.	2007-11-29
Apparatus for making circuitized substrates in a continuous manner App 20070266555 - Lauffer; John M. ; et al.	2007-11-22
Apparatus and method for making circuitized substrates in a continuous manner Grant 7,293,355 - Lauffer , et al. November 13, 2	2007-11-13
Method of making circuitized substrate with internal organic memory device App 20070249089 - Desai; Subahu D. ; et al.	2007-10-25
Method for making a multilayered circuitized substrate App 20070199195 - Davis; Thomas J. ; et al.	2007-08-30
Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same Grant 7,253,502 - Desai , et al. August 7, 2	2007-08-07
Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate App 20070177331 - Das; Rabindra N. ; et al.	2007-08-02
Method of making circuitized substrate App 20070166944 - Japp; Robert M. ; et al.	2007-07-19
Method of making circuitized substrate with split conductive layer and information handling system utilizing same App 20070144772 - Lauffer; John M. ; et al.	2007-06-28
Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate Grant 7,235,745 - Das , et al. June 26, 2	2007-06-26
Method of improving electrical connections in circuitized substrates App 20070139977 - Desai; Subahu D. ; et al.	2007-06-21
Method of making multilayered printed circuit board with filled conductive holes Grant 7,211,289 - Larnerd , et al. May 1, 2	2007-05-01
Method and apparatus for depositing conductive paste in circuitized substrate openings Grant 7,211,470 - Card , et al. May 1, 2	2007-05-01
Method of making a printed circuit board with low cross-talk noise App 20070089290 - Lauffer; John M. ; et al.	2007-04-26
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making Grant 7,209,368 - Lauffer , et al. April 24, 2	2007-04-24
Method and apparatus for depositing conductive paste in circuitized substrate openings App 20070048897 - Card; Norman A. ; et al.	2007-03-01
Printed circuit board with low cross-talk noise Grant 7,176,383 - Lauffer , et al. February 13, 2	2007-02-13
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate App 20070010064 - Das; Rabindra N. ; et al.	2007-01-11
Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate App 20070007033 - Das; Rabindra N. ; et al.	2007-01-11
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate App 20070010065 - Das; Rabindra N. ; et al.	2007-01-11
Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same Grant 7,157,646 - Lauffer , et al. January 2, 2	2007-01-02
Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same Grant 7,157,647 - Lauffer , et al. January 2, 2	2007-01-02
Method of making high speed circuit board Grant 7,152,319 - Chan , et al. December 26, 2	2006-12-26
Method of making circuitized substrate with filled isolation border App 20060248717 - Lauffer; John M. ; et al.	2006-11-09
Apparatus and method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner App 20060240364 - Lauffer; John M. ; et al.	2006-10-26
Apparatus and method for making circuitized substrates in a continuous manner App 20060240641 - Lauffer; John M. ; et al.	2006-10-26
Method of making circuitized substrate with signal wire shielding App 20060200977 - Lauffer; John M. ; et al.	2006-09-14
Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same App 20060180343 - Chan; Benson ; et al.	2006-08-17
Method of providing printed circuit board with conductive holes and board resulting therefrom App 20060183316 - Larnerd; James M. ; et al.	2006-08-17
Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate App 20060151202 - Das; Rabindra N. ; et al.	2006-07-13
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate App 20060154501 - Das; Rabindra N. ; et al.	2006-07-13
Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate App 20060154434 - Das; Rabindra N. ; et al.	2006-07-13
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate App 20060151863 - Das; Rabindra N. ; et al.	2006-07-13
Circuitized substrate assembly and method of making same Grant 7,071,423 - Fuller, Jr. , et al. July 4, 2	2006-07-04
Method of making circuitized substrate assembly App 20060123626 - Fuller; James W. JR. ; et al.	2006-06-15
Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components App 20060121722 - Card; Norman A. ; et al.	2006-06-08
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof App 20060121738 - Egitto; Frank D. ; et al.	2006-06-08
Circuitized substrates utilizing smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same App 20060110898 - Lauffer; John M. ; et al.	2006-05-25
Method of making circuitized substrate assembly Grant 7,047,630 - Fuller, Jr. , et al. May 23, 2	2006-05-23
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same Grant 7,045,897 - Egitto , et al. May 16, 2	2006-05-16
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Grant 7,025,607 - Das , et al. April 11, 2	2006-04-11
Formation of multisegmented plated through holes Grant 6,996,903 - Farquhar , et al. February 14, 2	2006-02-14
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same Grant 6,995,322 - Chan , et al. February 7, 2	2006-02-07
Circuitized substrate with internal organic memory device, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20060022303 - Desai; Subahu D. ; et al.	2006-02-02
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same App 20060022310 - Egitto; Frank D. ; et al.	2006-02-02
Method of forming printed circuit card Grant 6,986,198 - Fallon , et al. January 17, 2	2006-01-17
Method of forming printed circuit card App 20060005383 - Fallon; Kenneth ; et al.	2006-01-12
Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20060000639 - Lauffer; John M. ; et al.	2006-01-05
Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20060000636 - Lauffer; John M. ; et al.	2006-01-05
Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same Grant 6,964,884 - Chan , et al. November 15, 2	2005-11-15
Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making App 20050195585 - Lauffer, John M. ; et al.	2005-09-08
Printed circuit board with low cross-talk noise App 20050133257 - Lauffer, John M. ; et al.	2005-06-23
Method of providing printed circuit board with conductive holes and board resulting therefrom App 20050136646 - Larnerd, James M. ; et al.	2005-06-23
Information handling system utilizing circuitized substrate Grant 6,900,392 - Fuller, Jr. , et al. May 31, 2	2005-05-31
High performance dense wire for printed circuit board Grant 6,894,228 - Anstrom , et al. May 17, 2	2005-05-17
Formation of multisegmented plated through holes App 20050079289 - Farquhar, Donald S. ; et al.	2005-04-14
Information handling system utilizing circuitized substrate Grant 6,872,894 - Fuller, Jr. , et al. March 29, 2	2005-03-29
High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same App 20050039950 - Chan, Benson ; et al.	2005-02-24
Information handling system utilizing circuitized substrate App 20050023035 - Fuller, James W. JR. ; et al.	2005-02-03
Circuitized substrate assembly and method of making same App 20050011670 - Fuller, James W. JR. ; et al.	2005-01-20
Method for forming a substructure of a multilayered laminate Grant 6,832,436 - Anstrom , et al. December 21, 2	2004-12-21
Copper cleaning compositions, processes and products derived therefrom Grant 6,830,627 - Covert , et al. December 14, 2	2004-12-14
Forming a through hole in a photoimageable dielectric structure Grant 6,830,875 - Fuerniss , et al. December 14, 2	2004-12-14
High speed circuit board and method for fabrication Grant 6,828,514 - Chan , et al. December 7, 2	2004-12-07
High speed circuit board and method for fabrication App 20040231888 - Chan, Benson ; et al.	2004-11-25
Printed circuit board capacitor structure and method Grant 6,815,085 - Appelt , et al. November 9, 2	2004-11-09
Circuitized substrate assembly and method of making same Grant 6,809,269 - Fuller, Jr. , et al. October 26, 2	2004-10-26
Circuitized substrate assembly and method of making same App 20040177998 - Fuller, James W. JR. ; et al.	2004-09-16
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Grant 6,781,064 - Appelt , et al. August 24, 2	2004-08-24
High speed circuit board and method for fabrication App 20040150969 - Chan, Benson ; et al.	2004-08-05
Two signal one power plane circuit board App 20040134685 - Fallon, Kenneth ; et al.	2004-07-15
Information handling system utilizing circuitized substrate App 20040118598 - Fuller, James W. JR. ; et al.	2004-06-24
Circuitized substrate assembly and method of making same App 20040118596 - Fuller, James W. JR. ; et al.	2004-06-24
Two signal one power plane circuit board Grant 6,750,405 - Fallon , et al. June 15, 2	2004-06-15
Method for producing printed circuit board with embedded decoupling capacitance Grant 6,739,027 - Lauffer , et al. May 25, 2	2004-05-25
Method for producing dendrite interconnect for planarization Grant 6,739,046 - Appelt , et al. May 25, 2	2004-05-25
Printed wiring board Grant 6,740,819 - Bhatt , et al. May 25, 2	2004-05-25
Formation of multisegmented plated through holes Grant 6,700,078 - Farquhar , et al. March 2, 2	2004-03-02
Laser ablatable material and its use Grant 6,689,543 - Kresge , et al. February 10, 2	2004-02-10
Printed circuit board capacitor structure and method App 20030202314 - Appelt, Bernd K., ; et al.	2003-10-30
Printed wiring board App 20030188890 - Bhatt, Anilkumar C. ; et al.	2003-10-09
Method of forming a capacitive element Grant 6,625,857 - Appelt , et al. September 30, 2	2003-09-30
Method for making a printed wiring board Grant 6,608,757 - Bhatt , et al. August 19, 2	2003-08-19
Printed wiring board structure with z-axis interconnections Grant 6,593,534 - Jones , et al. July 15, 2	2003-07-15
Circuitry with integrated passive components and method for producing Grant 6,542,379 - Lauffer , et al. April 1, 2	2003-04-01
Forming a through hole in a photoimageable dielectric structure App 20030047357 - Fuerniss, Stephen J. ; et al.	2003-03-13
Method of making a parallel capacitor laminate Grant 6,524,352 - Adae-Amoakoh , et al. February 25, 2	2003-02-25
High performance dense wire for printed circuit board App 20030006857 - Anstrom, Donald O. ; et al.	2003-01-09
High performance dense wire for printed circuit board Grant 6,495,772 - Anstrom , et al. December 17, 2	2002-12-17
Composite laminate circuit structure and methods of interconnecting the same Grant 6,479,093 - Lauffer , et al. November 12, 2	2002-11-12
Formation of multisegmented plated through holes App 20020164468 - Farquhar, Donald S. ; et al.	2002-11-07
High Performance Dense Wire For Printed Circuit Board App 20020148637 - Anstrom, Donald O. ; et al.	2002-10-17
Printed wiring board structure with z-axis interconnections App 20020131229 - Jones, Gerald W. ; et al.	2002-09-19
Method for producing conductor interconnect with dendrites Grant 6,427,323 - Appelt , et al. August 6, 2	2002-08-06
Conductive substructures of a multilayered laminate App 20020100613 - Anstrom, Donald O. ; et al.	2002-08-01
Peripheral power board structure Grant 6,426,466 - Chamberlin , et al. July 30, 2	2002-07-30
Formation of multisegmented plated through holes Grant 6,426,470 - Farquhar , et al. July 30, 2	2002-07-30
Composite laminate circuit structure and methods of interconnecting the same App 20020098331 - Lauffer, John M. ; et al.	2002-07-25
Printed wiring board with improved plated through hole fatigue life Grant 6,423,905 - Brodsky , et al. July 23, 2	2002-07-23
Formation Of Multisegmented Plated Through Holes App 20020092677 - Farquhar, Donald S. ; et al.	2002-07-18
Laser ablatable material and its use App 20020094491 - Kresge, John S. ; et al.	2002-07-18
Multilayer capacitance structure and circuit board containing the same and method of forming the same App 20020080556 - Japp, Robert M. ; et al.	2002-06-27
Conductive substructures of a multilayered laminate Grant 6,407,341 - Anstrom , et al. June 18, 2	2002-06-18
Method of making a parallel capacitor laminate App 20020054471 - Adae-Amoakoh, Sylvia ; et al.	2002-05-09
Capacitor laminate for use in printed circuit board and as an interconnector Grant 6,370,012 - Adae-Amoakoh , et al. April 9, 2	2002-04-09
Process for manufacturing a multi-layer circuit board App 20010042733 - Appelt, Bernd K. ; et al.	2001-11-22
Conductor interconnect with dendrites through film and method for producing same App 20010034937 - Appelt, Bernd K. ; et al.	2001-11-01
Printed circuit board capacitor structure and method App 20010022718 - Appelt, Bernd K. ; et al.	2001-09-20
Method of forming a chip carrier by joining a laminate layer and stiffener App 20010018799 - Lauffer, John M. ; et al.	2001-09-06
Method for producing a circuit board with embedded decoupling capacitance Grant 6,256,850 - Lauffer , et al. July 10, 2	2001-07-10
Printed circuit board capacitor structure and method App 20010005304 - Appelt, Bernd K. ; et al.	2001-06-28
Electronic package on metal carrier Grant 6,252,179 - Lauffer , et al. June 26, 2	2001-06-26
Printed circuit board capacitor structure and method Grant 6,215,649 - Appelt , et al. April 10, 2	2001-04-10
Filling open through holes in a multilayer board Grant 6,204,456 - Lauffer , et al. March 20, 2	2001-03-20
Two signal one power plane circuit board Grant 6,204,453 - Fallon , et al. March 20, 2	2001-03-20
Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric Grant 6,201,194 - Lauffer , et al. March 13, 2	2001-03-13
Laminate substrate having joining layer of photoimageable material Grant 6,195,264 - Lauffer , et al. February 27, 2	2001-02-27
Copper etching compositions, processes and products derived therefrom Grant 6,156,221 - Lauffer , et al. December 5, 2	2000-12-05
Sequential build-up organic chip carrier and method of manufacture Grant 6,080,668 - Lauffer , et al. June 27, 2	2000-06-27
Dendrite interconnect for planarization and method for producing same Grant 5,977,642 - Appelt , et al. November 2, 1	1999-11-02
Electrical and/or thermal interconnections and methods for obtaining such Grant 5,189,261 - Alexander , et al. February 23, 1	1993-02-23
Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards Grant 5,027,253 - Lauffer , et al. June 25, 1	1991-06-25