Laudick; David A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Laudick; David A..The latest application filed is for "contained ostomy appliance".
- Laudick; David A. - Spring City TN
- Laudick; David A - Kokomo IN
- Laudick; David A. - Kokomo IN
| Patent | Date |
|---|---|
| Contained ostomy appliance App 20120078208 - Laudick; David A. | 2012-03-29 |
| Method of producing an overmolded electronic module with a flexible circuit pigtail Grant 7,739,791 - Brandenburg , et al. June 22, 2 | 2010-06-22 |
| Compliant pin strip with integrated dam bar App 20100032183 - Brandenburg; Scott D. ; et al. | 2010-02-11 |
| Method of overmolding an electronic assembly having an insert-molded vertical mount connector header Grant 7,603,770 - Brandenburg , et al. October 20, 2 | 2009-10-20 |
| Method of producing an overmolded electronic module with a flexible circuit pigtail App 20090106974 - Brandenburg; Scott D. ; et al. | 2009-04-30 |
| Method of overmolding an electronic assembly having an insert-molded vertical mount connector header App 20090085248 - Brandenburg; Scott D. ; et al. | 2009-04-02 |
| Method of making an electronic assembly Grant 7,510,108 - Lawlyes , et al. March 31, 2 | 2009-03-31 |
| Technique for manufacturing an overmolded electronic assembly Grant 7,473,585 - Brandenburg , et al. January 6, 2 | 2009-01-06 |
| Sealed electronic component App 20080053700 - O'Connor; Kurt F. ; et al. | 2008-03-06 |
| Technique for manufacturing an overmolded electronic assembly Grant 7,268,429 - Brandenburg , et al. September 11, 2 | 2007-09-11 |
| Overmolded electronic assembly with insert molded heat sinks Grant 7,230,829 - Mandel , et al. June 12, 2 | 2007-06-12 |
| Method of making an electronic assembly App 20070023488 - Lawlyes; Daniel A. ; et al. | 2007-02-01 |
| Technique for manufacturing an overmolded electronic assembly App 20060292751 - Brandenburg; Scott D. ; et al. | 2006-12-28 |
| Technique for manufacturing an overmolded electronic assembly App 20060281230 - Brandenburg; Scott D. ; et al. | 2006-12-14 |
| Overmolded electronic assembly with insert molded heat sinks App 20060171120 - Mandel; Larry M. ; et al. | 2006-08-03 |
| DAL spinner App 20060083869 - Laudick; David A. | 2006-04-20 |
| Technique for connector to printed circuit board decoupling to eliminate flexure Grant 6,905,349 - Brandenburg , et al. June 14, 2 | 2005-06-14 |
| Wafer applied thermally conductive interposer Grant 6,875,636 - Brandenburg , et al. April 5, 2 | 2005-04-05 |
| Wafer applied thermally conductive interposer App 20050014312 - Brandenburg, Scott D. ; et al. | 2005-01-20 |
| Filtered electrical connector assembly for an overmolded electronic package App 20040132322 - Brandenburg, Scott D. ; et al. | 2004-07-08 |
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