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Lau; Wai Ching Andy Patent Filings

Lau; Wai Ching Andy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lau; Wai Ching Andy.The latest application filed is for "ultrasonic cut and bonded elastic material".

Company Profile
0.9.8
  • Lau; Wai Ching Andy - Hong Kong HK
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for joining fabric panels and manufacturing brassieres
Grant 8,888,555 - Lau November 18, 2
2014-11-18
Ultrasonic cut and bonded elastic material and brassiere including same
Grant 8,257,141 - Lau September 4, 2
2012-09-04
Shoulder strap and method for manufacturing the same
Grant 8,226,453 - Lau July 24, 2
2012-07-24
Bonded elastic
Grant 8,114,498 - Lau February 14, 2
2012-02-14
Ultrasonic Cut And Bonded Elastic Material
App 20110281499 - LAU; Wai Ching Andy
2011-11-17
Method For Joining Fabric Panels And Manufacturing Brassieres
App 20110171881 - LAU; Wai Ching Andy
2011-07-14
Ultrasonic cut and bonded elastic material
Grant 7,972,455 - Lau July 5, 2
2011-07-05
Method for joining fabric panels and manufacturing brassieres
Grant 7,927,441 - Lau April 19, 2
2011-04-19
Bonded Elastic
App 20100143688 - Lau; Wai Ching Andy
2010-06-10
Method of making a bonded hem using an elastic strip with a raised fleece surface
Grant 7,678,220 - Lau March 16, 2
2010-03-16
Presser foot
Grant 7,640,879 - Lau January 5, 2
2010-01-05
Ultrasonic Cut And Bonded Elastic Material
App 20080081166 - Lau; Wai Ching Andy
2008-04-03
Presser Foot
App 20080078314 - Lau; Wai Ching Andy
2008-04-03
Bonded Elastic
App 20080081168 - Lau; Wai Ching Andy
2008-04-03
Shoulder Strap And Method For Manufacturing The Same
App 20080060745 - Lau; Wai Ching Andy
2008-03-13
Method For Joining Fabric Panels And Manufacturing Brassieres
App 20070287358 - Lau; Wai Ching Andy
2007-12-13

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