Lau; Teck Beng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lau; Teck Beng.The latest application filed is for "flexible packaged integrated circuit".
- Lau; Teck Beng - Petaling Jaya N/A MY
| Patent | Date |
|---|---|
| Flexible packaged integrated circuit Grant 9,287,236 - Lau , et al. March 15, 2 | 2016-03-15 |
| Flexible Packaged Integrated Circuit App 20160020189 - Lau; Teck Beng ; et al. | 2016-01-21 |
| Side vented pressure sensor device Grant 9,040,335 - Boon Yew , et al. May 26, 2 | 2015-05-26 |
| Multi-die Sensor Device App 20150137279 - Tiu; Kong Bee ; et al. | 2015-05-21 |
| Dual Corner Top Gate Molding App 20150118802 - Low; Boon Yew ; et al. | 2015-04-30 |
| Solar powered IC chip Grant 8,809,078 - Lau , et al. August 19, 2 | 2014-08-19 |
| Solar Powered Ic Chip App 20140225211 - Lau; Teck Beng ; et al. | 2014-08-14 |
| Solar powered IC chip Grant 8,778,704 - Lau , et al. July 15, 2 | 2014-07-15 |
| Semiconductor package and method of testing same Grant 8,338,828 - Low , et al. December 25, 2 | 2012-12-25 |
| Semiconductor Package And Method Of Testing Same App 20120032167 - LOW; Boon Yew ; et al. | 2012-02-09 |
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