Lau; Tauman T.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lau; Tauman T..The latest application filed is for "extended hbm offsets in 2.5d interposers".
- Lau; Tauman T. - San Jose CA
- Lau; Tauman T - San Jose CA
| Patent | Date |
|---|---|
| Extended Hbm Offsets In 2.5d Interposers App 20220302080 - Ali; Mohamed Anwar ; et al. | 2022-09-22 |
| Die Reuse In Electrical Circuits App 20140312475 - Ali; Anwar ; et al. | 2014-10-23 |
| Separate probe and bond regions of an integrated circuit Grant 8,115,321 - Ali , et al. February 14, 2 | 2012-02-14 |
| Method and apparatus of power ring positioning to minimize crosstalk Grant 7,863,716 - Ali , et al. January 4, 2 | 2011-01-04 |
| Separate Probe And Bond Regions Of An Integrated Circuit App 20100276816 - ALI; ANWAR ; et al. | 2010-11-04 |
| Power configuration method for structured ASICs Grant 7,737,564 - Ali , et al. June 15, 2 | 2010-06-15 |
| Method And Apparatus Of Power Ring Positioning To Minimize Crosstalk App 20090321897 - Ali; Anwar ; et al. | 2009-12-31 |
| Method and apparatus of power ring positioning to minimize crosstalk Grant 7,569,472 - Ali , et al. August 4, 2 | 2009-08-04 |
| Method and apparatus of power ring positioning to minimize crosstalk App 20080099905 - Ali; Anwar ; et al. | 2008-05-01 |
| Cell-based method for creating slotted metal in semiconductor designs Grant 7,328,417 - Ali , et al. February 5, 2 | 2008-02-05 |
| Power configuration method for structured ASICs App 20070164451 - Ali; Anwar ; et al. | 2007-07-19 |
| Test structure for detecting bonding-induced cracks Grant 6,998,638 - Low , et al. February 14, 2 | 2006-02-14 |
| Dielectric stack Grant 6,963,138 - Low , et al. November 8, 2 | 2005-11-08 |
| Cell-based method for creating slotted metal in semiconductor designs App 20050125759 - Ali, Anwar ; et al. | 2005-06-09 |
| Integrated circuit design for both input output limited and core limited integrated circuits Grant 6,836,026 - Ali , et al. December 28, 2 | 2004-12-28 |
| Test structure for detecting bonding-induced cracks App 20040217487 - Low, Qwai H. ; et al. | 2004-11-04 |
| Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors Grant 6,798,069 - Ali , et al. September 28, 2 | 2004-09-28 |
| Laterally interconnecting structures Grant 6,784,102 - Yeung , et al. August 31, 2 | 2004-08-31 |
| Test structure for detecting bonding-induced cracks Grant 6,781,150 - Low , et al. August 24, 2 | 2004-08-24 |
| Dielectric stack App 20040150069 - Low, Qwai H. ; et al. | 2004-08-05 |
| Circuit component placement Grant 6,768,142 - Ali , et al. July 27, 2 | 2004-07-27 |
| Laterally interconnecting structures App 20040072421 - Yeung, Max M. ; et al. | 2004-04-15 |
| Test structure App 20040043656 - Low, Qwai H. ; et al. | 2004-03-04 |
| Contact ring architecture Grant 6,683,476 - Ali , et al. January 27, 2 | 2004-01-27 |
| Circuit component placement App 20030209731 - Ali, Anwar ; et al. | 2003-11-13 |
| Contact ring architecture App 20030210076 - Ali, Anwar ; et al. | 2003-11-13 |
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