Lau; Siu Wing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lau; Siu Wing.The latest application filed is for "die bonding apparatus comprising an inert gas environment".
- Lau; Siu Wing - Kwai Chung HK
- LAU; Siu Wing - Hong Kong HK
- Lau, Siu Wing - Kowloon HK
| Patent | Date |
|---|---|
| Die bonding apparatus comprising an inert gas environment Grant 10,475,763 - Lau , et al. Nov | 2019-11-12 |
| Die Bonding Apparatus Comprising An Inert Gas Environment App 20160351527 - LAU; Siu Wing ; et al. | 2016-12-01 |
| Die bonding process incorporating infrared vision system Grant 8,633,441 - Wang , et al. January 21, 2 | 2014-01-21 |
| Die Bonding Process Incorporating Infrared Vision System App 20110051124 - WANG; Ran Shi ; et al. | 2011-03-03 |
| Optical system having selectable field for inspection Grant 7,830,597 - Lau , et al. November 9, 2 | 2010-11-09 |
| Optical System Having Selectable Field For Inspection App 20090067043 - LAU; Siu Wing ; et al. | 2009-03-12 |
| Apparatus and method for indexing and severing film App 20050034577 - Au, Yuk Cheung ; et al. | 2005-02-17 |
| Multi-pin epoxy writing apparatus App 20030044534 - Lau, Siu Wing ; et al. | 2003-03-06 |
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