Lau; Kee Kwang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lau; Kee Kwang.The latest application filed is for "flip chip in package using flexible and removable leadframe".

Company Profile

0.5.8

Lau; Kee Kwang - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package structure Grant 8,766,438 - Chew , et al. July 1, 2	2014-07-01
Package design and method of manufacture for chip grid array Grant 7,456,496 - Hwee , et al. November 25, 2	2008-11-25
Flip Chip In Package Using Flexible And Removable Leadframe App 20080150107 - TAN; Teck Tiong ; et al.	2008-06-26
Flip chip in package using flexible and removable leadframe App 20070196979 - Tan; Teck Tiong ; et al.	2007-08-23
Embedded passive component App 20060060937 - Lim; Eng Han Matthew ; et al.	2006-03-23
Package design and method of manufacture for chip grid array App 20050205987 - Hwee, Tan Kim ; et al.	2005-09-22
Package design and method of manufacture for chip grid array Grant 6,929,981 - Hwee , et al. August 16, 2	2005-08-16
Leadless semiconductor packaging structure with inverted flip chip and methods of manufacture App 20040108580 - Tan, Kim Hwee ; et al.	2004-06-10
Semiconductor chip grid array package design and method of manufacture Grant 6,734,039 - Hwee , et al. May 11, 2	2004-05-11
Method for constraining the spread of solder during reflow for preplated high wettability lead frame flip chip assembly App 20040084508 - Briar, John ; et al.	2004-05-06
Semiconductor chip grid array package design and method of manufacture App 20040046238 - Hwee, Tan Kim ; et al.	2004-03-11
Package design and method of manufacture for chip grid array App 20040046257 - Hwee, Tan Kim ; et al.	2004-03-11

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