Lau; John Hon-Shing

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lau; John Hon-Shing.The latest application filed is for "circuit board structure and manufacturing method thereof".

Company Profile

2.6.16

Lau; John Hon-Shing - New Territories HK
Lau; John Hon-Shing - Taoyuan City TW
Lau; John Hon-Shing - Taoyuan TW
Lau; John Hon Shing - Palo Alto CA
Lau; John Hon-Shing - Hsinchu N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package structure and manufacturing method thereof Grant 11,445,617 - Yang , et al. September 13, 2	2022-09-13
Circuit Board Structure And Manufacturing Method Thereof App 20220256717 - Lau; John Hon-Shing ; et al.	2022-08-11
Package structure and manufacturing method thereof Grant 11,410,933 - Lau , et al. August 9, 2	2022-08-09
Circuit Substrate Structure And Manufacturing Method Thereof App 20220130781 - Tseng; Tzyy-Jang ; et al.	2022-04-28
Package Structure And Manufacturing Method Thereof App 20220108953 - Lau; John Hon-Shing ; et al.	2022-04-07
Circuit Board Structure And Manufacturing Method Thereof App 20220071015 - Tseng; Tzyy-Jang ; et al.	2022-03-03
Integrated Circuit Package Structure And Method Of Manufacturing The Same App 20220068832 - YANG; KAI-MING ; et al.	2022-03-03
Probe Card Testing Device App 20220065897 - Tseng; Tzyy-Jang ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220069489 - Lau; John Hon-Shing ; et al.	2022-03-03
Circuit Board Structure And Manufacturing Method Thereof App 20220071000 - Tseng; Tzyy-Jang ; et al.	2022-03-03
Manufacturing Method Of The Chip Package Structure App 20210398925 - Lau; John Hon-Shing ; et al.	2021-12-23
Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof Grant 11,145,610 - Lau , et al. October 12, 2	2021-10-12
Vapor Chamber Structure And Manufacturing Method Thereof App 20210247147 - Tain; Ra-Min ; et al.	2021-08-12
Vapor Chamber Structure And Manufacturing Method Thereof App 20210251107 - Tain; Ra-Min ; et al.	2021-08-12
Chip Package Structure And Manufacturing Method Thereof App 20210202407 - Lau; John Hon-Shing ; et al.	2021-07-01
Package Structure And Manufacturing Method Thereof App 20190239362 - YANG; Kai-Ming ; et al.	2019-08-01
Thermally-enhanced provision of underfill to electronic devices using a stencil Grant 9,583,366 - Zhang , et al. February 28, 2	2017-02-28
Thermally-enhanced Provision Of Underfill To Electronic Devices App 20160276177 - ZHANG; Qinglong ; et al.	2016-09-22
Packaging substrate having embedded interposer and fabrication method thereof Grant 9,385,056 - Hu , et al. July 5, 2	2016-07-05
Packaging Substrate Having Embedded Interposer And Fabrication Method Thereof App 20130032390 - Hu; Dyi-Chung ; et al.	2013-02-07

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