LAU; Hon Shing, John
Patent Applications and Registrations
Patent applications and USPTO patent grants for LAU; Hon Shing, John.The latest application filed is for "three-dimensional integrated fan-out wafer level package".
- LAU; Hon Shing, John - Palo Alto CA
- Lau; Hon-Shing John - Singapore SG
| Patent | Date |
|---|---|
| Three-dimensional Integrated Fan-out Wafer Level Package App 20190006339 - LAU; Hon Shing, John ; et al. | 2019-01-03 |
| Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement App 20120126419 - Kripesh; Vaidyanathan ; et al. | 2012-05-24 |
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