Lau; Daniel K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lau; Daniel K..The latest application filed is for "lead frame with included passive devices".
- Lau; Daniel K. - San Francisco CA
- Lau; Daniel K. - Stonecrest Drive CA
| Patent | Date |
|---|---|
| Semiconductor device package and method for manufacturing same Grant 7,563,648 - Islam , et al. July 21, 2 | 2009-07-21 |
| Lead frame with included passive devices Grant 7,489,021 - Juskey , et al. February 10, 2 | 2009-02-10 |
| Lead Frame with Included Passive Devices App 20080036034 - Juskey; Frank J. ; et al. | 2008-02-14 |
| Thermal enhanced package for block mold assembly Grant 7,259,445 - Lau , et al. August 21, 2 | 2007-08-21 |
| Thin multiple semiconductor die package Grant 7,247,933 - Juskey , et al. July 24, 2 | 2007-07-24 |
| Semiconductor device package and method for manufacturing same App 20070161157 - Islam; Shafidul ; et al. | 2007-07-12 |
| Thermal Enhanced Package For Block Mold Assembly App 20070065984 - Lau; Daniel K. ; et al. | 2007-03-22 |
| Thin multiple semiconductor die package App 20060231937 - Juskey; Frank J. ; et al. | 2006-10-19 |
| Thermal enhanced package for block mold assembly App 20060166397 - Lau; Daniel K. ; et al. | 2006-07-27 |
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