Latta; Richard W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Latta; Richard W..The latest application filed is for "method employing an elevating of atmospheric pressure during the heating and/or cooling phases of ball grid array (bga) soldering of an ic device to a pcb".
- Latta; Richard W. - Boise ID
| Patent | Date |
|---|---|
| Method employing an elevating of atmospheric pressure during the heating and/or cooling phases of ball grid array (BGA) soldering of an IC device to a PCB Grant 5,385,291 - Latta January 31, 1 | 1995-01-31 |
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