loadpatents
name:-0.19387888908386
name:-0.018409967422485
name:-0.00099897384643555
Larson; Lary R. Patent Filings

Larson; Lary R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Larson; Lary R..The latest application filed is for "hermetically-sealed electrical circuit apparatus".

Company Profile
0.16.13
  • Larson; Lary R. - Gold Canyon AZ US
  • Larson; Lary R. - Tempe AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Media-exposed interconnects for transducers
Grant 9,616,223 - Schugt , et al. April 11, 2
2017-04-11
Hermetically-sealed Electrical Circuit Apparatus
App 20140374145 - Gerrish; Paul F. ;   et al.
2014-12-25
Hermeticity testing
Grant 7,902,851 - Fenner , et al. March 8, 2
2011-03-08
Pressure sensor configurations for implantable medical electrical leads
Grant 7,886,608 - Mothilal , et al. February 15, 2
2011-02-15
Hermeticity Testing
App 20100315110 - Fenner; Andreas Armin ;   et al.
2010-12-16
Hermetically-sealed Electrical Circuit Apparatus
App 20100314149 - Gerrish; Paul F. ;   et al.
2010-12-16
Pressure Sensor Configurations For Implantable Medical Electrical Leads
App 20090308169 - Mothilal; Kamal Deep ;   et al.
2009-12-17
Pressure sensor configurations for implantable medical electrical leads
Grant 7,591,185 - Mothilal , et al. September 22, 2
2009-09-22
Media-exposed interconnects for transducers
App 20070160748 - Schugt; Michael A. ;   et al.
2007-07-12
Single axis accelerometer and method therefore
Grant 7,142,921 - Mattes , et al. November 28, 2
2006-11-28
Single axis accelerometer and method therefore
App 20050131482 - Mattes, Michael F. ;   et al.
2005-06-16
Feed through assembly for a formable flat battery
Grant 6,899,976 - Larson , et al. May 31, 2
2005-05-31
High voltage flip-chip component package and method for forming the same
Grant 6,836,022 - Boone , et al. December 28, 2
2004-12-28
Method for stacking semiconductor die within an implanted medical device
Grant 6,780,770 - Larson August 24, 2
2004-08-24
High voltage flip-chip component package and method for forming the same
App 20040159956 - Boone, Mark R. ;   et al.
2004-08-19
Variable infusion rate catheter
Grant 6,749,581 - Thompson , et al. June 15, 2
2004-06-15
Method and apparatus for wafer-level burn-in
Grant 6,627,917 - Fenner , et al. September 30, 2
2003-09-30
Single-use therapeutic substance delivery device with infusion rate control
Grant 6,562,000 - Thompson , et al. May 13, 2
2003-05-13
Interconnection of active and passive components in substrate
App 20030080401 - Fenner, Andreas Armin ;   et al.
2003-05-01
Implantable medical device employing integral housing for a formable flat battery
App 20030040781 - Larson, Lary R. ;   et al.
2003-02-27
Implantable medical device employing integral housing for a formable flat battery
Grant 6,498,951 - Larson , et al. December 24, 2
2002-12-24
Method for stacking semiconductor die within an implanted medical device
App 20020123233 - Larson, Lary R.
2002-09-05
Single-use Therapeutic Substance Delivery Device With Infusion Rate Control
App 20020107472 - Thompson, David L. ;   et al.
2002-08-08
Variable Infusion Rate Catheter
App 20020107471 - Thompson, David L. ;   et al.
2002-08-08
Interconnection of active and passive components in substrate
App 20020074633 - Larson, Lary R. ;   et al.
2002-06-20
Accelerometer for implantable medical device
Grant 6,216,537 - Henschel , et al. April 17, 2
2001-04-17
Feedthrough assembly for implantable medical devices and methods for providing same
Grant 6,052,623 - Fenner , et al. April 18, 2
2000-04-18
Cardiac monitoring apparatus
Grant 4,230,127 - Larson October 28, 1
1980-10-28

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