Larnerd; John D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Larnerd; John D..The latest application filed is for "method of additive circuitization of circuit boards with high adhesion, voidless copper leads".
- Larnerd; John D. - Owego NY
- Larnerd; John D. - Vestal NY
| Patent | Date |
|---|---|
| Method of additive circuitization of circuit boards with high adhesion, voidless copper leads Grant 5,166,037 - Atkinson , et al. November 24, 1 | 1992-11-24 |
| Apparatus for connecting contact pins to a substrate Grant 4,550,493 - Darrow , et al. November 5, 1 | 1985-11-05 |
| Method Of Aligning And Attaching Circuit Devices On A Substrate Grant 3,811,186 - Larnerd , et al. May 21, 1 | 1974-05-21 |
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