Laporte; Philippe
Patent Applications and Registrations
Patent applications and USPTO patent grants for Laporte; Philippe.The latest application filed is for "device for separating wafers and process for using said device".
- Laporte; Philippe - Sassenage FR
- Laporte; Philippe - Echirolles FR
| Patent | Date |
|---|---|
| Device for separating wafers and process for using said device Grant 6,077,383 - Laporte June 20, 2 | 2000-06-20 |
| Process for etching and depositing integrated circuit interconnections and contacts Grant 5,354,711 - Heitzmann , et al. October 11, 1 | 1994-10-11 |
| Enclosure for the treatment, and particularly for the etching of substrates by the reactive plasma method Grant 4,491,496 - Laporte , et al. January 1, 1 | 1985-01-01 |
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