Patent | Date |
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Hybrid dielectric scheme for varying liner thickness and manganese concentration Grant 11,348,872 - Briggs , et al. May 31, 2 | 2022-05-31 |
Semiconductor tool matching and manufacturing management in a blockchain Grant 11,223,655 - Bhosale , et al. January 11, 2 | 2022-01-11 |
Optimizating Semiconductor Binning By Feed-forward Process Adjustment App 20210249288 - Briggs; Benjamin D. ;   et al. | 2021-08-12 |
Optimizing semiconductor binning by feed-forward process adjustment Grant 11,049,744 - Briggs , et al. June 29, 2 | 2021-06-29 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration Grant 10,978,393 - Briggs , et al. April 13, 2 | 2021-04-13 |
Interconnect with self-forming wrap-all-around barrier layer Grant 10,978,342 - Huang , et al. April 13, 2 | 2021-04-13 |
Magnetic tunnel junction with low series resistance Grant 10,796,833 - Lanzillo , et al. October 6, 2 | 2020-10-06 |
Structures and methods for embedded magnetic random access memory (MRAM) fabrication Grant 10,770,511 - Clevenger , et al. Sep | 2020-09-08 |
Accelerated wafer testing using non-destructive and localized stress Grant 10,746,782 - Briggs , et al. A | 2020-08-18 |
Accelerated wafer testing using non-destructive and localized stress Grant 10,739,397 - Briggs , et al. A | 2020-08-11 |
Fully aligned semiconductor device with a skip-level via Grant 10,741,751 - Lanzillo , et al. A | 2020-08-11 |
Interconnect with Self-Forming Wrap-All-Around Barrier Layer App 20200243383 - Huang; Huai ;   et al. | 2020-07-30 |
Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield Grant 10,720,567 - Briggs , et al. | 2020-07-21 |
Fully Aligned Semiconductor Device With A Skip-level Via App 20200136028 - Lanzillo; Nicholas A. ;   et al. | 2020-04-30 |
Magnetic Tunnel Junction With Low Series Resistance App 20200098499 - Lanzillo; Nicholas A. ;   et al. | 2020-03-26 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration App 20200091079 - Briggs; Benjamin D. ;   et al. | 2020-03-19 |
Semiconductor Tool Matching And Manufacturing Management In A Blockchain App 20200053128 - Bhosale; Prasad ;   et al. | 2020-02-13 |
Fully aligned semiconductor device with a skip-level via Grant 10,553,789 - Lanzillo , et al. Fe | 2020-02-04 |
Skip via for metal interconnects Grant 10,319,629 - Yang , et al. | 2019-06-11 |
Structures And Methods For Embedded Magnetic Random Access Memory (mram) Fabrication App 20190165042 - Clevenger; Lawrence A. ;   et al. | 2019-05-30 |
Optimizating Semiconductor Binning By Feed-forward Process Adjustment App 20190122911 - Briggs; Benjamin D. ;   et al. | 2019-04-25 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration Grant 10,256,191 - Briggs , et al. | 2019-04-09 |
Structures and methods for embedded magnetic random access memory (MRAM) fabrication Grant 10,243,020 - Clevenger , et al. | 2019-03-26 |
Reducing metallic interconnect resistivity through application of mechanical strain Grant 10,211,155 - Briggs , et al. Feb | 2019-02-19 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration App 20190013278 - Briggs; Benjamin D. ;   et al. | 2019-01-10 |
Accelerated Wafer Testing Using Non-destructive And Localized Stress App 20180328979 - Briggs; Benjamin D. ;   et al. | 2018-11-15 |
Accelerated Wafer Testing Using Non-destructive And Localized Stress App 20180328977 - Briggs; Benjamin D. ;   et al. | 2018-11-15 |
Reducing Metallic Interconnect Resistivity Through Application Of Mechanical Strain App 20180277482 - Briggs; Benjamin D. ;   et al. | 2018-09-27 |
Prevention of Switching of Spins in Magnetic Tunnel Junctions by On-Chip Parasitic Magnetic Shield App 20180269383 - Briggs; Benjamin D. ;   et al. | 2018-09-20 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration App 20180211920 - Briggs; Benjamin D. ;   et al. | 2018-07-26 |
Prevention of switching of spins in magnetic tunnel junctions by on-chip parasitic magnetic shield Grant 9,985,199 - Briggs , et al. May 29, 2 | 2018-05-29 |
Reducing metallic interconnect resistivity through application of mechanical strain Grant 9,941,211 - Briggs , et al. April 10, 2 | 2018-04-10 |