Langley; Rodney C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Langley; Rodney C..The latest application filed is for "method for plasma etching a wafer".

Company Profile

0.6.4

Langley; Rodney C. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with improved bond pads Grant RE40,819 - Langley July 7, 2	2009-07-07
Method for plasma etching a wafer App 20050048781 - Langley, Rodney C. ; et al.	2005-03-03
Method and apparatus for plasma etching a wafer Grant 6,838,390 - Langley , et al. January 4, 2	2005-01-04
Method and apparatus for plasma etching a wafer App 20020142593 - Langley, Rodney C. ; et al.	2002-10-03
Method and apparatus for inspecting wafers Grant 6,424,733 - Langley July 23, 2	2002-07-23
Semiconductor processing apparatuses, and methods of forming antireflective coating materials over substrates App 20010019899 - Rolfson, J. Brett ; et al.	2001-09-06
Method And Apparatus For Inspecting Wafers App 20010012392 - LANGLEY, RODNEY C.	2001-08-09
Semiconductor device with improved bond pads Grant 5,686,762 - Langley November 11, 1	1997-11-11
Method to eliminate corrosion in conductive elements Grant 5,376,235 - Langley December 27, 1	1994-12-27
Process and system for stabilizing layer deposition and etch rates while simultaneously maintaining cleanliness in a water processing reaction chamber Grant 5,221,414 - Langley , et al. June 22, 1	1993-06-22

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