Langley; Rod C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Langley; Rod C..The latest application filed is for "anisotropic etch method".
- Langley; Rod C. - Boise ID
| Patent | Date |
|---|---|
| Anisotropic etch method Grant 7,375,036 - Langley May 20, 2 | 2008-05-20 |
| Anisotropic etch method App 20050026440 - Langley, Rod C. | 2005-02-03 |
| Anisotropic etch method Grant 6,686,295 - Langley February 3, 2 | 2004-02-03 |
| Anisotropic etch method App 20020192973 - Langley, Rod C. | 2002-12-19 |
| Anisotropic etch method App 20020185470 - Langley, Rod C. | 2002-12-12 |
| Anisotropic etch method Grant 5,958,801 - Langley September 28, 1 | 1999-09-28 |
| Semiconductor processing method of providing an electrically conductive interconnecting plug between an elevationally conductive node and an elevationally outer electrically conductive node Grant 5,960,314 - Rhodes , et al. September 28, 1 | 1999-09-28 |
| Method to remove fluorine residues from bond pads Grant 5,380,401 - Jones , et al. January 10, 1 | 1995-01-10 |
| Anisotropic etch method Grant 5,271,799 - Langley December 21, 1 | 1993-12-21 |
| Anisotropic etch method Grant 5,169,487 - Langley , et al. December 8, 1 | 1992-12-08 |
| Self-aligned sloped contact Grant 5,094,900 - Langley March 10, 1 | 1992-03-10 |
| Planarizing contact etch Grant 4,939,105 - Langley July 3, 1 | 1990-07-03 |
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