Langkabel; Eike

Patent Applications and Registrations

Patent applications and USPTO patent grants for Langkabel; Eike.The latest application filed is for "latent epoxy resin formulations for liquid impregnation processes for production of fibre composite materials".

Company Profile

10.13.17

Langkabel; Eike - Wegberg N/A DE
Langkabel; Eike - Wegbeg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Storage-stable polyurethane prepregs and mouldings produced therefrom composed of a polyurethane composition with liquid resin components Grant 10,633,519 - Spyrou , et al.	2020-04-28
Storage-stable one-component polyurethane prepregs and shaped bodies composed of polyurethane composition that have been produced therefrom Grant 10,626,236 - Spyrou , et al.	2020-04-21
Epoxy resin compositions for production of storage-stable composites Grant 10,392,469 - Ortelt , et al. A	2019-08-27
Latent epoxy resin formulations for liquid impregnation processes for production of fibre composite materials Grant 10,280,252 - Ortelt , et al.	2019-05-07
Epoxy resin composition comprising 2-(3-(aminomethyl)-3,5,5-trimethylcyclohexyl)propane-1,3-diamine (AM-CPDA) as hardener Grant 10,221,277 - Langkabel , et al.	2019-03-05
Epoxy resin composition comprising 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine as hardener Grant 10,214,612 - Langkabel , et al. Feb	2019-02-26
Latent epoxy resin formulations for liquid impregnation processes for production of fibre-reinforced composites Grant 10,155,840 - Ortelt , et al. Dec	2018-12-18
Latent Epoxy Resin Formulations For Liquid Impregnation Processes For Production Of Fibre Composite Materials App 20180162991 - ORTELT; Martina ; et al.	2018-06-14
Curable composition with high fracture toughness Grant 9,994,671 - Ortelt , et al. June 12, 2	2018-06-12
Storage-stable One-component Polyurethane Prepregs And Shaped Bodies Composed Of Polyurethane Composition That Have Been Produced Therefrom App 20180155515 - Spyrou; Emmanouil ; et al.	2018-06-07
Reinforcing Bar, Method For The Production, And Use App 20180127980 - Fuchsmann; Dirk ; et al.	2018-05-10
Epoxy Resin Composition Comprising 2-(3,3,5-trimethylcyclohexyl)propane-1,3-diamine As Hardener App 20170355810 - Langkabel; Eike ; et al.	2017-12-14
Epoxy Resin Composition Comprising 2-(3-(aminomethyl)-3,5,5-trimethylcyclohexyl)propane-1,3-diamine (am-cpda) As Hardener App 20170355809 - Langkabel; Eike ; et al.	2017-12-14
Epoxy Resin Composition Comprising 2-(2,2,6,6-tetramethylpiperidin-4-yl)propane-1,3-diamine As Hardener App 20170355808 - Langkabel; Eike ; et al.	2017-12-14
Epoxy Resin Compositions For Production Of Storage-stable Composites App 20170166687 - ORTELT; Martina ; et al.	2017-06-15
Latent Epoxy Resin Formulations For Liquid Impregnation Processes For Production Of Fibre-reinforced Composites App 20170166688 - ORTELT; Martina ; et al.	2017-06-15
Curable Composition With High Fracture Toughness App 20150376327 - ORTELT; Martina ; et al.	2015-12-31
Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input Grant 8,916,267 - Bauer , et al. December 23, 2	2014-12-23
Storage-stable Polyurethane Prepregs And Mouldings Produced Therefrom Composed Of A Polyurethane Composition With Liquid Resin Components App 20140087613 - Spyrou; Emmanouil ; et al.	2014-03-27
Adhesive Composition For Detachable Adhesive Bonds And Modification Of The Encapsulation Materials For A Purposeful Energy Input App 20130196143 - Bauer; Monika ; et al.	2013-08-01
Adhesive composition for detachable adhesive bonds and modification of the encapsulation materials for a purposeful energy input Grant 8,377,245 - Bauer , et al. February 19, 2	2013-02-19
Adhesive Composition For Detachable Adhesive Bonds And Modification Of The Encapsulation Materials For A Purposeful Energy Input App 20120114952 - Bauer; Monika ; et al.	2012-05-10
Soft magnetic material for manufacturing printed circuit boards App 20060154052 - Waffenschmidt; Eberhard ; et al.	2006-07-13

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