Langenthal; Scott I.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Langenthal; Scott I..The latest application filed is for "dielectric interposer for chip to substrate soldering".
- Langenthal; Scott I. - Hyde Park NY
- Langenthal; Scott I. - Pleasant Valley NY
| Patent | Date |
|---|---|
| Dielectric interposer for chip to substrate soldering Grant 6,984,792 - Brofman , et al. January 10, 2 | 2006-01-10 |
| Dielectric interposer for chip to substrate soldering Grant 6,657,313 - Brofman , et al. December 2, 2 | 2003-12-02 |
| Dielectric interposer for chip to substrate soldering App 20030193093 - Brofman, Peter J. ; et al. | 2003-10-16 |
| Multilayer ceramic substrate with anchored pad Grant 6,312,791 - Fasano , et al. November 6, 2 | 2001-11-06 |
| Process for forming cone shaped solder for chip interconnection App 20010015495 - Brofman, Peter J. ; et al. | 2001-08-23 |
| Method for producing ceramic surfaces with easily removable contact sheets Grant 6,139,666 - Fasano , et al. October 31, 2 | 2000-10-31 |
| Ceramic substrate having a sealed layer Grant 6,136,419 - Fasano , et al. October 24, 2 | 2000-10-24 |
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