Lang; Dennis

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lang; Dennis.The latest application filed is for "high temperature operating package and circuit design".

Company Profile

0.6.8

Lang; Dennis - Orange CA US
Lang; Dennis - San Jose CA
Lang; Dennis - Sunol CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High temperature operating package and circuit design Grant 8,803,239 - Thornton , et al. August 12, 2	2014-08-12
High Temperature Operating Package And Circuit Design App 20120032712 - Thornton; Neill ; et al.	2012-02-09
High temperature operating package and circuit design Grant 8,030,764 - Thornton , et al. October 4, 2	2011-10-04
Reliable Wafer-level Chip-scale Solder Bump Structure App 20100117231 - Lang; Dennis ; et al.	2010-05-13
High Temperature Operating Package And Circuit Design App 20090189678 - Thornton; Neill ; et al.	2009-07-30
Packaged semiconductor device and method of manufacture using shaped die Grant 7,390,698 - Thornton , et al. June 24, 2	2008-06-24
Reliable Wafer-level Chip-scale Package Solder Bump Structure In A Packaged Semiconductor Device App 20080054461 - Lang; Dennis ; et al.	2008-03-06
High temperature operating package and circuit design App 20080054496 - Thornton; Neill ; et al.	2008-03-06
Packaged semiconductor device and method of manufacture using shaped die App 20060220241 - Thornton; Neill ; et al.	2006-10-05
Packaged semiconductor device and method of manufacture using shaped die Grant 7,084,488 - Thornton , et al. August 1, 2	2006-08-01
Semiconductor package comprising vertical power transistor Grant 6,674,157 - Lang January 6, 2	2004-01-06
Semiconductor packages for semiconductor devices App 20030085464 - Lang, Dennis	2003-05-08
Packaged semiconductor device and method of manufacture using shaped die App 20030025183 - Thornton, Neill ; et al.	2003-02-06

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