loadpatents
name:-0.0090479850769043
name:-0.0075170993804932
name:-0.00031495094299316
Lane; Sarah L. Patent Filings

Lane; Sarah L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lane; Sarah L..The latest application filed is for "low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties".

Company Profile
0.8.8
  • Lane; Sarah L. - Wappingers Falls NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated circuit comb capacitor
Grant 8,120,143 - Edelstein , et al. February 21, 2
2012-02-21
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties
Grant 7,998,880 - Nguyen , et al. August 16, 2
2011-08-16
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES
App 20100028695 - Nguyen; Son V. ;   et al.
2010-02-04
Integrated circuit comb capacitor
Grant 7,585,722 - Edelstein , et al. September 8, 2
2009-09-08
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
Grant 7,494,938 - Nguyen , et al. February 24, 2
2009-02-24
Integrated Circuit Comb Capacitor
App 20080130200 - Edelstein; Daniel C. ;   et al.
2008-06-05
Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties
Grant 7,265,437 - Nguyen , et al. September 4, 2
2007-09-04
Integrated Circuit Comb Capacitor
App 20070158717 - Edelstein; Daniel C. ;   et al.
2007-07-12
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films
App 20070128882 - Nguyen; Son V. ;   et al.
2007-06-07
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
Grant 7,202,564 - Nguyen , et al. April 10, 2
2007-04-10
LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES
App 20060202311 - Nguyen; Son V. ;   et al.
2006-09-14
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films
App 20060183345 - Nguyen; Son ;   et al.
2006-08-17
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
Grant 6,939,797 - Barth , et al. September 6, 2
2005-09-06
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
App 20040173908 - Barth, Edward ;   et al.
2004-09-09
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
Grant 6,737,747 - Barth , et al. May 18, 2
2004-05-18
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof
App 20030132510 - Barth, Edward ;   et al.
2003-07-17

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