| Patent | Date |
|---|
Semiconductor chips including passivation layer trench structure
Grant 8,803,318 - Kulkarni , et al. August 12, 2 | 2014-08-12 |
Semiconductor Chips Including Passivation Layer Trench Structure
App 20130207263 - Kulkarni; Deepak ; et al. | 2013-08-15 |
Semiconductor chips including passivation layer trench structure
Grant 8,440,505 - Kulkarni , et al. May 14, 2 | 2013-05-14 |
Device and methodology for reducing effective dielectric constant in semiconductor devices
Grant 8,343,868 - Edelstein , et al. January 1, 2 | 2013-01-01 |
Reducing effective dielectric constant in semiconductor devices
Grant 8,129,286 - Edelstein , et al. March 6, 2 | 2012-03-06 |
Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures
Grant 8,076,756 - Lane , et al. December 13, 2 | 2011-12-13 |
Structure For Inhibiting Back End Of Line Damage From Dicing And Chip Packaging Interaction Failures
App 20110140245 - LANE; MICHAEL W. ; et al. | 2011-06-16 |
Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures
Grant 7,955,955 - Lane , et al. June 7, 2 | 2011-06-07 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20110111590 - Edelstein; Daniel C. ; et al. | 2011-05-12 |
Device and methodology for reducing effective dielectric constant in semiconductor devices
Grant 7,892,940 - Edelstein , et al. February 22, 2 | 2011-02-22 |
BEOL interconnect structures with improved resistance to stress
Grant 7,847,402 - Restaino , et al. December 7, 2 | 2010-12-07 |
Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer
Grant 7,820,559 - Clevenger , et al. October 26, 2 | 2010-10-26 |
Semiconductor Chips Including Passivation Layer Trench Structure
App 20100187689 - Kulkarni; Deepak ; et al. | 2010-07-29 |
Device and methodology for reducing effective dielectric constant in semiconductor devices
Grant 7,592,685 - Edelstein , et al. September 22, 2 | 2009-09-22 |
Crack trapping and arrest in thin film structures
Grant 7,573,130 - Shaw , et al. August 11, 2 | 2009-08-11 |
Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
Grant 7,517,790 - Fitzsimmons , et al. April 14, 2 | 2009-04-14 |
Method of forming crack trapping and arrest in thin film structures
Grant 7,491,578 - Shaw , et al. February 17, 2 | 2009-02-17 |
Inhibiting Damage From Dicing And Chip Packaging Interaction Failures In Back End Of Line Structures
App 20080277765 - Lane; Michael W. ; et al. | 2008-11-13 |
Structure To Improve Adhesion Between Top Cvd Low-k Dielectric And Dielectric Capping Layer
App 20080254643 - Clevenger; Lawrence A. ; et al. | 2008-10-16 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20080254630 - EDELSTEIN; Daniel C. ; et al. | 2008-10-16 |
Beol Interconnect Structures With Improved Resistance To Stress
App 20080197513 - Restaino; Darryl D. ; et al. | 2008-08-21 |
Device and methodology for reducing effective dielectric constant in semiconductor devices
Grant 7,405,147 - Edelstein , et al. July 29, 2 | 2008-07-29 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
Grant 7,402,532 - Clevenger , et al. July 22, 2 | 2008-07-22 |
Method And Structure To Enhance Temperature/humidity/bias Performance Of Semiconductor Devices By Surface Modification
App 20080079176 - Fitzsimmons; John A. ; et al. | 2008-04-03 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20080038915 - EDELSTEIN; Daniel C. ; et al. | 2008-02-14 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20080038923 - EDELSTEIN; Daniel C. ; et al. | 2008-02-14 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
App 20070148958 - Clevenger; Lawrence A. ; et al. | 2007-06-28 |
Alignment Mark With Improved Resistance To Dicing Induced Cracking And Delamination In The Scribe Region
App 20070108638 - Lane; Michael W. ; et al. | 2007-05-17 |
Interlevel dielectric layer and metal layer sealing
Grant 7,214,608 - Angyal , et al. May 8, 2 | 2007-05-08 |
Copper conductor
Grant 7,119,018 - Lane , et al. October 10, 2 | 2006-10-10 |
Crackstop with release layer for crack control in semiconductors
Grant 7,109,093 - Fitzsimmons , et al. September 19, 2 | 2006-09-19 |
Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer
Grant 7,102,232 - Clevenger , et al. September 5, 2 | 2006-09-05 |
Interlevel Dielectric Layer And Metal Layer Sealing
App 20060024961 - Angyal; Matthew S. ; et al. | 2006-02-02 |
Structure to improve adhesion between top CVD low-k dielectiric and dielectric capping layer
App 20050230831 - Clevenger, Lawrence A. ; et al. | 2005-10-20 |
Crackstop With Release Layer For Crack Control In Semiconductors
App 20050208781 - Fitzsimmons, John A. ; et al. | 2005-09-22 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices
App 20050167838 - Edelstein, Daniel C. ; et al. | 2005-08-04 |
Process for forming an electrically conductive interconnect
App 20050118796 - Chiras, Stefanie R. ; et al. | 2005-06-02 |
Method And Structure To Enhance Temperature/humidity/bias Performance Of Semiconductor Devices By Surface Modification
App 20050116357 - Fitzsimmons, John A. ; et al. | 2005-06-02 |
Flight attendant actuated warning system and method
Grant 6,816,087 - Lane November 9, 2 | 2004-11-09 |
Flight attendant actuated warning system and method
App 20040027256 - Lane, Michael W. | 2004-02-12 |
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