loadpatents
name:-0.0094919204711914
name:-0.0067570209503174
name:-0.00047111511230469
Lane; Lawrence Patent Filings

Lane; Lawrence

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lane; Lawrence.The latest application filed is for "optical metrology model optimization for process control".

Company Profile
0.7.7
  • Lane; Lawrence - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Selection of wavelengths for integrated circuit optical metrology
Grant 7,474,993 - Doddi , et al. January 6, 2
2009-01-06
Selecting a hypothetical profile to use in optical metrology
Grant 7,394,554 - Vuong , et al. July 1, 2
2008-07-01
Optical metrology model optimization for process control
Grant 7,395,132 - Prager , et al. July 1, 2
2008-07-01
Optical metrology model optimization for process control
App 20070225851 - Prager; Dan ;   et al.
2007-09-27
Selection of wavelengths for integrated circuit optical metrology
App 20070198211 - Doddi; Srinivas ;   et al.
2007-08-23
Optical metrology model optimization for process control
Grant 7,221,989 - Prager , et al. May 22, 2
2007-05-22
Selection of wavelengths for integrated circuit optical metrology
Grant 7,216,045 - Doddi , et al. May 8, 2
2007-05-08
Optical metrology model optimization for process control
App 20060247816 - Prager; Dan ;   et al.
2006-11-02
Optical metrology model optimization for process control
Grant 7,065,423 - Prager , et al. June 20, 2
2006-06-20
Optical metrology model optimization for process control
App 20060009872 - Prager; Dan ;   et al.
2006-01-12
Selecting a hypothetical profile to use in optical metrology
App 20050057748 - Vuong, Vi ;   et al.
2005-03-17
Selection of wavelengths for integrated circuit optical metrology
App 20030225535 - Doddi, Srinivas ;   et al.
2003-12-04
Measurement of metal electroplating and seed layer thickness and profile
Grant 6,608,686 - Lane , et al. August 19, 2
2003-08-19
Measurement Of Metal Electroplating And Seed Layer Thickness And Profile
App 20030151751 - Lane, Lawrence ;   et al.
2003-08-14

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