Landreville; Jean-Luc

Patent Applications and Registrations

Patent applications and USPTO patent grants for Landreville; Jean-Luc.The latest application filed is for "mechanical barrier element for improved thermal reliability of electronic components".

Company Profile

0.7.8

Landreville; Jean-Luc - Canton de Granby CA
Landreville; Jean-Luc - Grandby CA
Landreville; Jean-Luc - Granby CA
Landreville; Jean-Luc - Cranby CA
Landreville, Jean-Luc - Canto de Granby CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mold shave apparatus and injection molded soldering process Grant 8,162,199 - Bourchard , et al. April 24, 2	2012-04-24
Mechanical Barrier Element for Improved Thermal Reliability of Electronic Components App 20110042784 - Edwards; David L. ; et al.	2011-02-24
Piston reset apparatus for a multichip module and method for resetting pistons in the same Grant 7,826,228 - Audet , et al. November 2, 2	2010-11-02
Mold Shave Apparatus And Injection Molded Soldering Process App 20090294090 - Bouchard; Eric E. ; et al.	2009-12-03
Piston Reset Apparatus For A Multichip Module And Method For Resetting Pistons In The Same App 20080264606 - Audet; Gerald P. ; et al.	2008-10-30
Piston reset apparatus for a multichip module and method for resetting pistons in the same Grant 7,405,940 - Audet , et al. July 29, 2	2008-07-29
Mold Shave Apparatus And Injection Molded Soldering Process App 20080156849 - Bouchard; Eric E. ; et al.	2008-07-03
Area array package with low inductance connecting device Grant 7,066,740 - Audet , et al. June 27, 2	2006-06-27
Injection molded continuously solidified solder method and apparatus App 20050263571 - Belanger, Luc ; et al.	2005-12-01
Anti-vibration and anti-tilt structure Grant 6,957,794 - Landreville , et al. October 25, 2	2005-10-25
Area Array Package With Low Inductance Connecting Device App 20050013124 - Audet, Jean ; et al.	2005-01-20
Connecting devices and method for interconnecting circuit components Grant 6,652,290 - Audet , et al. November 25, 2	2003-11-25
Anti-vibration and anti-tilt structure App 20030010877 - Landreville, Jean-Luc ; et al.	2003-01-16
Connecting devices and method for interconnecting circuit components App 20020019153 - Audet, Gerald P. ; et al.	2002-02-14
Connecting devices and method for interconnecting circuit components Grant 6,302,702 - Audet , et al. October 16, 2	2001-10-16

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