Landis; Howard S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Landis; Howard S..The latest application filed is for "modifying design layer of integrated circuit (ic)".

Company Profile

1.44.36

Landis; Howard S. - Essex Junction VT
Landis; Howard S. - Underhill VT
Landis; Howard S - Underhill VT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Modifying design layer of integrated circuit (IC) using nested and non-nested fill objects Grant 10,254,642 - Deshpande , et al.	2019-04-09
Modifying Design Layer Of Integrated Circuit (ic) App 20180180989 - Deshpande; Veeresh V. ; et al.	2018-06-28
Modifying design layer of integrated circuit (IC) Grant 9,977,325 - Deshpande , et al. May 22, 2	2018-05-22
Modifying Design Layer Of Integrated Circuit (ic) App 20170108769 - Deshpande; Veeresh V. ; et al.	2017-04-20
Trimming of dummy fill shapes holes to affect near-neighbor dummy fill shapes with built-in optical proximity corrections for semiconductor applications Grant 9,170,482 - Landis October 27, 2	2015-10-27
Parameter variation improvement Grant 8,954,901 - Bashaboina , et al. February 10, 2	2015-02-10
Method and system allowing for semiconductor design rule optimization Grant 8,839,177 - Aubel , et al. September 16, 2	2014-09-16
Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections Grant 8,796,133 - Bonilla , et al. August 5, 2	2014-08-05
Near-neighbor Trimming Of Dummy Fill Shapes With Built-in Optical Proximity Corrections For Semiconductor Applications App 20140215417 - LANDIS; Howard S.	2014-07-31
Near-neighbor trimming of dummy fill shapes with built-in optical proximity corrections for semiconductor applications Grant 8,739,078 - Landis May 27, 2	2014-05-27
Optimization Metallization For Prevention Of Dielectric Cracking Under Controlled Collapse Chip Connections App 20140021622 - Bonilla; Griselda ; et al.	2014-01-23
Method of forming a semiconductor device having a cut-way hole to expose a portion of a hardmask layer Grant 8,507,346 - Burkhardt , et al. August 13, 2	2013-08-13
Wafer Fill Patterns And Uses App 20130181267 - Burkhardt; Martin ; et al.	2013-07-18
Near-neighbor Trimming Of Dummy Fill Shapes With Built-in Optical Proximity Corrections For Semiconductor Applications App 20130183832 - Landis; Howard S.	2013-07-18
Methods and systems to meet technology pattern density requirements of semiconductor fabrication processes Grant 8,423,945 - Bickford , et al. April 16, 2	2013-04-16
Current-aligned auto-generated non-equiaxial hole shape for wiring Grant 8,299,775 - Landis , et al. October 30, 2	2012-10-30
Parameter Variation Improvement App 20120144354 - Bashaboina; Pavan Y. ; et al.	2012-06-07
Wafer Fill Patterns And Uses App 20120126294 - Burkhardt; Martin ; et al.	2012-05-24
Metal fill structures for reducing parasitic capacitance Grant 8,138,607 - Collins , et al. March 20, 2	2012-03-20
Methods and Systems to Meet Technology Pattern Density Requirements of Semiconductor Fabrication Processes App 20110289470 - BICKFORD; Jeanne P. ; et al.	2011-11-24
System and method of automated wire and via layout optimization description Grant 7,930,667 - Bergman Reuter , et al. April 19, 2	2011-04-19
Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics Grant 7,888,800 - Landis February 15, 2	2011-02-15
Modifying layout of IC based on function of interconnect and related circuit and design structure Grant 7,886,240 - Adkisson , et al. February 8, 2	2011-02-08
Structure for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masks Grant 7,861,208 - Faure , et al. December 28, 2	2010-12-28
Structure and method for sub-resolution dummy clear shapes for improved gate dimensional control Grant 7,858,269 - Landis , et al. December 28, 2	2010-12-28
Metal Fill Structures for Reducing Parasitic Capacitance App 20100264545 - Collins; David S. ; et al.	2010-10-21
System and method of automated wire and via layout optimization description Grant 7,739,632 - Bergman Reuter , et al. June 15, 2	2010-06-15
Circuit element function matching despite auto-generated dummy shapes Grant 7,721,248 - Landis May 18, 2	2010-05-18
Shapes-based migration of aluminum designs to copper damascene Grant 7,709,967 - Dunham , et al. May 4, 2	2010-05-04
Structure and method for partitioned dummy fill shapes for reduced mask bias with alternating phase shift masks Grant 7,709,300 - Faure , et al. May 4, 2	2010-05-04
Regional pattern density determination method and system Grant 7,703,053 - Abbott , et al. April 20, 2	2010-04-20
Increased power line noise immunity in IC using capacitor structure in fill area Grant 7,689,961 - Braun , et al. March 30, 2	2010-03-30
Crack trapping and arrest in thin film structures Grant 7,573,130 - Shaw , et al. August 11, 2	2009-08-11
Modifying Layout Of Ic Based On Function Of Interconnect And Related Circuit And Design Structure App 20090193378 - Adkisson; James W. ; et al.	2009-07-30
Variable overlap of dummy shapes for improved rapid thermal anneal uniformity Grant 7,537,941 - Anderson , et al. May 26, 2	2009-05-26
Design Structure For Partitioned Dummy Fill Shapes For Reduced Mask Bias With Alternating Phase Shift Masks App 20090100399 - FAURE; Thomas B. ; et al.	2009-04-16
Shapes-based migration of aluminum designs to copper damascene Grant 7,498,250 - Dunham , et al. March 3, 2	2009-03-03
Method of forming crack trapping and arrest in thin film structures Grant 7,491,578 - Shaw , et al. February 17, 2	2009-02-17
Dummy Metal Fill Shapes For Improved Reliability Of Hybrid Oxide/low-k Dielectrics App 20090032956 - LANDIS; Howard S.	2009-02-05
Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics Grant 7,479,701 - Landis January 20, 2	2009-01-20
Structure And Method For Sub-resolution Dummy Clear Shapes For Improved Gate Dimensional Control App 20080226992 - Landis; Howard S. ; et al.	2008-09-18
Regional Pattern Density Determination Method And System App 20080134111 - Abbott; Geoffrey K. ; et al.	2008-06-05
Structure And Method For Partitioned Dummy Fill Shapes For Reduced Mask Bias With Alternating Phase Shift Masks App 20080086714 - Faure; Thomas B. ; et al.	2008-04-10
System And Method Of Automated Wire And Via Layout Optimization Description App 20080072203 - BERGMAN REUTER; Bette L. ; et al.	2008-03-20
System And Method Of Automated Wire And Via Layout Optimization Description App 20080046852 - Bergman Reuter; Bette L. ; et al.	2008-02-21
Circuit Element Function Matching Despite Auto-generated Dummy Shapes App 20080022248 - Landis; Howard S.	2008-01-24
Shapes-based migration of aluminum designs to copper damascene Grant 7,312,141 - Dunham , et al. December 25, 2	2007-12-25
Variable Overlap Of Dummy Shapes For Improved Rapid Thermal Anneal Uniformity App 20070287200 - Anderson; Brent A. ; et al.	2007-12-13
Dummy Phase Shapes To Reduce Sensitivity Of Critical Gates To Regions Of High Pattern Density App 20070281218 - Landis; Howard S	2007-12-06
Shapes-based Migration Of Aluminum Designs To Copper Damascene App 20070273048 - Dunham; Timothy G. ; et al.	2007-11-29
Shapes-based Migration Of Aluminum Designs To Copper Damascene App 20070275551 - Dunham; Timothy G. ; et al.	2007-11-29
Circuit element function matching despite auto-generated dummy shapes Grant 7,269,818 - Landis September 11, 2	2007-09-11
Aligned dummy metal fill and hole shapes Grant 7,250,363 - Landis , et al. July 31, 2	2007-07-31
Increased Power Line Noise Immunity In Ic Using Capacitor Structure In Fill Area App 20070038968 - Braun; Florian ; et al.	2007-02-15
Current-aligned Auto-generated Non-equiaxial Hole Shape For Wiring App 20060292855 - Landis; Howard S. ; et al.	2006-12-28
Aligned Dummy Metal Fill And Hole Shapes App 20060252263 - Landis; Howard S. ; et al.	2006-11-09
Circuit Element Function Matching Despite Auto-generated Dummy Shapes App 20060150139 - Landis; Howard S.	2006-07-06
Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics App 20060118960 - Landis; Howard S.	2006-06-08
Shapes-based migration of aluminum designs to copper damascene App 20060081988 - Dunham; Timothy G. ; et al.	2006-04-20
Dummy metal fill shapes for improved reliability of hybrid oxide/low-k dielectrics Grant 7,015,582 - Landis March 21, 2	2006-03-21
Shapes-based migration of aluminum designs to copper damascence Grant 6,992,002 - Dunham , et al. January 31, 2	2006-01-31
Dummy Metal Fill Shapes For Improved Reliability Of Hybrid Oxide/low-k Dielectrics App 20040195670 - Landis, Howard S.	2004-10-07
Stacked fill structures for support of dielectric layers Grant 6,743,710 - Dunham , et al. June 1, 2	2004-06-01
Stacked fill structures for support of dielectric layers App 20030141598 - Dunham, Timothy G. ; et al.	2003-07-31
Stacked Fill Structures For Support Of Dielectric Layers App 20030094696 - Dunham, Timothy G. ; et al.	2003-05-22
Shapes-based migration of aluminum designs to copper damascene App 20030080435 - Dunham, Timothy G. ; et al.	2003-05-01
Shapes-based migration of aluminum designs to copper damascene Grant 6,528,883 - Dunham , et al. March 4, 2	2003-03-04
Low cost shallow trench isolation using non-conformal dielectric material App 20010036709 - Andrews, John W. ; et al.	2001-11-01
Low cost shallow trench isolation using non-conformal dielectric material Grant 6,270,353 - Andrews , et al. August 7, 2	2001-08-07
Method of forming borderless contacts using a removable mandrel Grant 5,466,636 - Cronin , et al. November 14, 1	1995-11-14
Planarized semiconductor structure using subminimum features Grant 5,453,639 - Cronin , et al. September 26, 1	1995-09-26
Method for planarizing semiconductor structure using subminimum features Grant 5,292,689 - Cronin , et al. March 8, 1	1994-03-08
Radial uniformity control of semiconductor wafer polishing Grant 5,036,630 - Kaanta , et al. August 6, 1	1991-08-06

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