LANDESBERGER; Christof

Patent Applications and Registrations

Patent applications and USPTO patent grants for LANDESBERGER; Christof.The latest application filed is for "microelectronic arrangement and method for manufacturing the same".

Company Profile

2.11.14

LANDESBERGER; Christof - Munich DE
LANDESBERGER; Christof - Munchen DE
Landesberger; Christof - Grafelfing DE
Landesberger; Christof - Graefelfing DE
Landesberger, Christof - Muenchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic Arrangement And Method For Manufacturing The Same App 20210375754 - LANDESBERGER; Christof ; et al.	2021-12-02
Antenna Module App 20210234256 - LANDESBERGER; Christof ; et al.	2021-07-29
Multi-Layer 3D Foil Package App 20210176864 - LANDESBERGER; Christof ; et al.	2021-06-10
Method for manufacturing planar thin packages Grant 10,752,499 - Landesberger , et al. A	2020-08-25
Device comprising film for electrostatic coupling of a substrate to a substrate carrier Grant 10,304,714 - Landesberger	2019-05-28
Method for Manufacturing Planar Thin Packages for Semiconductor Devices and Planar Thin Packages App 20190135618 - LANDESBERGER; Christof ; et al.	2019-05-09
Carrier wafer, method for holding a flexible substrate and method for the manufacture of a carrier wafer Grant 9,978,626 - Kutter , et al. May 22, 2	2018-05-22
Device Comprising Film For Electrostatic Coupling Of A Substrate To A Substrate Carrier App 20180108557 - LANDESBERGER; Christof	2018-04-19
Patterned Layer Compound App 20180035548 - LANDESBERGER; Christof ; et al.	2018-02-01
Carrier Wafer, Method For Holding A Flexible Substrate And Method For The Manufacture Of A Carrier Wafer App 20160035611 - Kutter; Christoph ; et al.	2016-02-04
Carrier Substrate And Method For Fixing A Substrate Structure App 20150332944 - LANDESBERGER; Christof	2015-11-19
Method of producing a chip package, and chip package Grant 8,563,358 - Landesberger , et al. October 22, 2	2013-10-22
Method for producing flexible integrated circuits which may be provided contiguously Grant 8,198,135 - Klink , et al. June 12, 2	2012-06-12
Method of Producing a Chip Package, and Chip Package App 20120091594 - LANDESBERGER; Christof ; et al.	2012-04-19
Method For Producing Flexible Integrated Circuits Which May Be Provided Contiguously App 20110047793 - KLINK; Gerhard ; et al.	2011-03-03
Method and device for electrostatic fixing of substrates with polarized molecules Grant 7,733,624 - Landesberger June 8, 2	2010-06-08
Method For The Selective Coating Of A Surface With Liquid App 20090162566 - Yacoub-George; Erwin ; et al.	2009-06-25
Method and Device for Electrostatic Fixing of Substrates With Polarizable Molecules App 20080232022 - Landesberger; Christof	2008-09-25
Method For Producing Flexible Integrated Circuits Which May Be Provided Contiguously App 20080076209 - KLINK; Gerhard ; et al.	2008-03-27
Mobile holder for a wafer Grant 7,027,283 - Landesberger , et al. April 11, 2	2006-04-11
Method of subdividing a wafer Grant 6,756,288 - Feil , et al. June 29, 2	2004-06-29
Mobile holder for a wafer App 20040037692 - Landesberger, Christof ; et al.	2004-02-26
Method for handling a plurality of circuit chips Grant 6,514,790 - Plettner , et al. February 4, 2	2003-02-04
Process for joining inorganic substrates in a permanent manner Grant 6,328,841 - Klumpp , et al. December 11, 2	2001-12-11

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