Landers; William F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Landers; William F..The latest application filed is for "three dimensional organic or glass interposer".

Company Profile

0.18.16

Landers; William F. - Wappingers Falls NY
Landers; William F - Hopewell Junction NY US
LANDERS; WILLIAM F. - HOPEWELL JUNCTION NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Three dimensional organic or glass interposer Grant 9,490,197 - Farooq , et al. November 8, 2	2016-11-08
Three Dimensional Organic Or Glass Interposer App 20160141237 - FAROOQ; Mukta G. ; et al.	2016-05-19
Structure and method for making crack stop for 3D integrated circuits Grant 9,059,167 - Farooq , et al. June 16, 2	2015-06-16
Structure And Method For Making Crack Stop For 3d Integrated Circuits App 20140339703 - Farooq; Mukta G. ; et al.	2014-11-20
Structure and method for making crack stop for 3D integrated circuits Grant 8,859,390 - Farooq , et al. October 14, 2	2014-10-14
TSV pillar as an interconnecting structure Grant 8,691,691 - Farooq , et al. April 8, 2	2014-04-08
Alignment marks to enable 3D integration Grant 8,546,961 - Farooq , et al. October 1, 2	2013-10-01
Tsv Pillar As An Interconnecting Structure App 20130026606 - Farooq; Mukta G. ; et al.	2013-01-31
Alignment Marks To Enable 3d Integration App 20120175789 - Farooq; Mukta G. ; et al.	2012-07-12
Structure And Method For Making Crack Stop For 3d Integrated Circuits App 20110193197 - FAROOQ; MUKTA G. ; et al.	2011-08-11
Method for fabricating last level copper-to-C4 connection with interfacial cap structure Grant 7,863,183 - Daubenspeck , et al. January 4, 2	2011-01-04
Strengthening of a structure by infiltration Grant 7,678,673 - Huang , et al. March 16, 2	2010-03-16
Method and structure for ultra narrow crack stop for multilevel semiconductor device Grant 7,544,602 - Clevenger , et al. June 9, 2	2009-06-09
Strengthening Of A Structure By Infiltration App 20090035480 - Huang; Elbert ; et al.	2009-02-05
Method And Structure For Ultra Narrow Crack Stop For Multilevel Semiconductor Device App 20080237868 - Clevenger; Lawrence A. ; et al.	2008-10-02
METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION App 20080073790 - Burrell; Lloyd G. ; et al.	2008-03-27
Structure and method for producing multiple size interconnections Grant 7,312,529 - Clevenger , et al. December 25, 2	2007-12-25
Method of fabricating a wire bond pad with Ni/Au metallization Grant 7,294,565 - Burrell , et al. November 13, 2	2007-11-13
Method For Fabricating Last Level Copper-to-c4 Connectionwith Interfacial Cap Structure App 20070166992 - Daubenspeck; Timothy H. ; et al.	2007-07-19
Semiconductors And Methods Of Making App 20070080455 - Zupanski-Nielsen; Donna S. ; et al.	2007-04-12
Structure And Method For Producing Multiple Size Interconnections App 20070007665 - Clevenger; Lawrence ; et al.	2007-01-11
Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor Grant 7,098,676 - Landers , et al. August 29, 2	2006-08-29
Novel integration of wire bond pad with Ni/Au metallization App 20050074959 - Burrell, Lloyd G. ; et al.	2005-04-07
Unique feature design enabling structural integrity for advanced low k semiconductor chips Grant 6,815,346 - Davis , et al. November 9, 2	2004-11-09
Multi-functional structure for enhanced chip manufacturibility & reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor App 20040129938 - Landers, William F. ; et al.	2004-07-08
Unique feature design enabling structural integrity for advanced low K semiconductor chips Grant 6,650,010 - Davis , et al. November 18, 2	2003-11-18
Unique feature design enabling structural integrity for advanced low K semiconductor chips App 20030197280 - Davis, Charles R. ; et al.	2003-10-23
Unique Feature Design Enabling Structural Integrity For Advanced Low K Semiconductor Chips App 20030155642 - Davis, Charles R. ; et al.	2003-08-21
Combined chemical mechanical polishing and reactive ion etching process Grant 6,221,775 - Ference , et al. April 24, 2	2001-04-24
Apparatus and method for controlling polishing of integrated circuit substrates Grant 6,102,776 - Boggs , et al. August 15, 2	2000-08-15

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