Landau; Stefan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Landau; Stefan.The latest application filed is for "laminate electronic device".
Company Profile
0.32.33
- Landau; Stefan - Wehrheim DE
Patent Activity
| Patent | Date |
|---|---|
| Laminate electronic device Grant 10,020,245 - Ewe , et al. July 10, 2 | 2018-07-10 |
| Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier Grant 9,953,952 - Mahler , et al. April 24, 2 | 2018-04-24 |
| Multi-chip module Grant 9,147,649 - Landau , et al. September 29, 2 | 2015-09-29 |
| Method and system for providing a reliable light emitting diode semiconductor device Grant 9,142,739 - Eder , et al. September 22, 2 | 2015-09-22 |
| Semiconductor device and method of manufacturing thereof Grant 8,980,687 - Nikitin , et al. March 17, 2 | 2015-03-17 |
| Semiconductor chip package and method Grant 8,969,985 - Strutz , et al. March 3, 2 | 2015-03-03 |
| Device including two semiconductor chips and manufacturing thereof Grant 8,866,302 - Ewe , et al. October 21, 2 | 2014-10-21 |
| Electronic module Grant 8,836,113 - Landau , et al. September 16, 2 | 2014-09-16 |
| Semiconductor device and method Grant 8,828,804 - Nikitin , et al. September 9, 2 | 2014-09-09 |
| Laminate Electronic Device App 20140117565 - Ewe; Henrik ; et al. | 2014-05-01 |
| Housing for a chip arrangement and a method for forming a housing Grant 8,687,370 - Landau , et al. April 1, 2 | 2014-04-01 |
| Die arrangement and method of forming a die arrangement Grant 8,686,569 - Daeche , et al. April 1, 2 | 2014-04-01 |
| Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts Grant 8,664,043 - Ewe , et al. March 4, 2 | 2014-03-04 |
| Chip Arrangements And A Method For Forming A Chip Arrangement App 20130341780 - Scharf; Thorsten ; et al. | 2013-12-26 |
| Method and System for Providing a Reliable Light Emitting Diode Semiconductor Device App 20130277704 - Eder; Andreas ; et al. | 2013-10-24 |
| Electronic Module App 20130264721 - Landau; Stefan ; et al. | 2013-10-10 |
| Semiconductor Device and Method of Manufacturing Thereof App 20130200502 - Nikitin; Ivan ; et al. | 2013-08-08 |
| Housing For A Chip Arrangement And A Method For Forming A Housing App 20130120940 - Landau; Stefan ; et al. | 2013-05-16 |
| Semiconductor Chip Package and Method App 20130049746 - Strutz; Volker ; et al. | 2013-02-28 |
| Electronic Module App 20120306069 - Landau; Stefan ; et al. | 2012-12-06 |
| Electronic module Grant 8,253,241 - Landau , et al. August 28, 2 | 2012-08-28 |
| Device Including Two Semiconductor Chips and Manufacturing Thereof App 20120187565 - Ewe; Henrik ; et al. | 2012-07-26 |
| Die Arrangement And Method Of Forming A Die Arrangement App 20120146201 - Daeche; Frank ; et al. | 2012-06-14 |
| Method And System For Providing A Reliable Light Emitting Diode Semiconductor Device App 20120061700 - EDER; Andreas ; et al. | 2012-03-15 |
| Method of manufacturing an integrated circuit module Grant 8,129,225 - Landau , et al. March 6, 2 | 2012-03-06 |
| Method of manufacturing a semiconductor device Grant 8,101,463 - Mengel , et al. January 24, 2 | 2012-01-24 |
| Semiconductor device including first and second carriers Grant 8,097,959 - Landau , et al. January 17, 2 | 2012-01-17 |
| Semiconductor device Grant 8,097,944 - Landau , et al. January 17, 2 | 2012-01-17 |
| Method for producing a power semiconductor module comprising surface-mountable flat external contacts Grant 7,955,901 - Ewe , et al. June 7, 2 | 2011-06-07 |
| Method of making semiconductor devices employing first and second carriers Grant 7,955,954 - Landau , et al. June 7, 2 | 2011-06-07 |
| Laminate Electronic Device App 20110127675 - Ewe; Henrik ; et al. | 2011-06-02 |
| Semiconductor Device And Method Including First And Second Carriers App 20110031597 - Landau; Stefan ; et al. | 2011-02-10 |
| Multi-chip module Grant 7,872,350 - Otremba , et al. January 18, 2 | 2011-01-18 |
| Semiconductor Device App 20100276797 - Landau; Stefan ; et al. | 2010-11-04 |
| Semiconductor Device App 20100200978 - Mengel; Manfred ; et al. | 2010-08-12 |
| Semiconductor Device App 20100044841 - Mahler; Joachim ; et al. | 2010-02-25 |
| Semiconductor device with conductive die attach material Grant 7,667,337 - Mahler , et al. February 23, 2 | 2010-02-23 |
| Electronic Module App 20090289354 - Landau; Stefan ; et al. | 2009-11-26 |
| Semiconductor Device And Method App 20090273066 - Nikitin; Ivan ; et al. | 2009-11-05 |
| Semiconductor Device And Method Including First And Second Carriers App 20090256247 - Landau; Stefan ; et al. | 2009-10-15 |
| Multi-chip Module App 20090189291 - Landau; Stefan ; et al. | 2009-07-30 |
| Method For Producing A Power Semiconductor Module Comprising Surface-mountable Flat External Contacts App 20090093090 - Ewe; Henrik ; et al. | 2009-04-09 |
| Semiconductor Device With Conductive Die Attach Material App 20090079088 - Mahler; Joachim ; et al. | 2009-03-26 |
| Method of Manufacturing an Integrated Circuit Module App 20090042337 - Landau; Stefan ; et al. | 2009-02-12 |
| Power semiconductor module having surface-mountable flat external contacts and method for producing the same Grant 7,479,691 - Ewe , et al. January 20, 2 | 2009-01-20 |
| Multi-Chip Module App 20080251912 - Otremba; Ralf ; et al. | 2008-10-16 |
| Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same App 20080067667 - Mahler; Joachim ; et al. | 2008-03-20 |
| Semiconductor Component Arrangement App 20080061449 - Mahler; Joachim ; et al. | 2008-03-13 |
| Power semiconductor module having surface-mountable flat external contacts and method for producing the same App 20070246808 - Ewe; Henrik ; et al. | 2007-10-25 |
| Process For Producing Power Semiconductor Components Using A Marker App 20070241328 - Landau; Stefan ; et al. | 2007-10-18 |
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