Lan; Yuan-Fu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lan; Yuan-Fu.The latest application filed is for "stacked package structure and fabricating method thereof".

Company Profile

9.5.9

Lan; Yuan-Fu - Hsinchu County TW
Lan; Yuan-Fu - Hukou Township Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method and a related stackable chip package Grant 11,024,603 - Chen , et al. June 1, 2	2021-06-01
Stacked package structure with encapsulation and redistribution layer and fabricating method thereof Grant 10,892,250 - Chen , et al. January 12, 2	2021-01-12
Stacked Package Structure And Fabricating Method Thereof App 20200203313 - Chen; Ming-Chih ; et al.	2020-06-25
Chip Package Structure And Manufacturing Method Thereof App 20190252325 - Chen; Yu-Wei ; et al.	2019-08-15
Manufacturing Method And A Related Stackable Chip Package App 20190244934 - Chen; Ming-Chih ; et al.	2019-08-08
Stacked package including exterior conductive element and a manufacturing method of the same Grant 10,354,978 - Chen , et al. July 16, 2	2019-07-16
Stacked Package Including Exterior Conductive Element And A Manufacturing Method Of The Same App 20190214366 - Chen; Ming-Chih ; et al.	2019-07-11
Stacked Package And A Manufacturing Method Of The Same App 20190214367 - Chen; Ming-Chih ; et al.	2019-07-11
Package process method including disposing a die within a recess of a one-piece material Grant 10,224,254 - Chen , et al.	2019-03-05
Package Process Method Including Disposing A Die Within A Recess Of A One-piece Material App 20180315674 - Chen; Ming-Chih ; et al.	2018-11-01
Manufacturing Method Of Package-on-package Structure App 20180114782 - Wang; Chi-An ; et al.	2018-04-26
Carrier substrate Grant 9,659,884 - Lan , et al. May 23, 2	2017-05-23
Semiconductor Structure App 20170047277 - Lan; Yuan-Fu ; et al.	2017-02-16
Carrier Substrate App 20170047295 - Lan; Yuan-Fu ; et al.	2017-02-16

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