loadpatents
name:-0.035328149795532
name:-0.032585144042969
name:-0.0072247982025146
Lan; Je-Hsiung Jeffrey Patent Filings

Lan; Je-Hsiung Jeffrey

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lan; Je-Hsiung Jeffrey.The latest application filed is for "integrated circuits (ics) on a glass substrate".

Company Profile
6.25.34
  • Lan; Je-Hsiung Jeffrey - San Diego CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Integrated circuits (ICs) on a glass substrate
Grant 10,903,240 - Gu , et al. January 26, 2
2021-01-26
Passive-on-glass (POG) device and method
Grant 10,607,980 - Lan , et al.
2020-03-31
Integrated Circuits (ics) On A Glass Substrate
App 20190259780 - GU; Shiqun ;   et al.
2019-08-22
Integrated circuits (ICs) on a glass substrate
Grant 10,332,911 - Gu , et al.
2019-06-25
Substrate comprising an embedded inductor and a thin film magnetic core
Grant 10,290,414 - Yun , et al.
2019-05-14
Tunable matching network
Grant 10,187,031 - Ma , et al. Ja
2019-01-22
Wafer level package (WLP) ball support using cavity structure
Grant 10,074,625 - Velez , et al. September 11, 2
2018-09-11
Encapsulation of acoustic resonator devices
Grant 10,069,474 - Yun , et al. September 4, 2
2018-09-04
Passive-on-glass (pog) Device And Method
App 20180145062 - Lan; Je-Hsiung Jeffrey ;   et al.
2018-05-24
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,966,426 - Mudakatte , et al. May 8, 2
2018-05-08
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,959,964 - Yun , et al. May 1, 2
2018-05-01
Electrode Wrap-around Capacitors For Radio Frequency (rf) Applications
App 20180083588 - YUN; Changhan Hobie ;   et al.
2018-03-22
Microelectromechanical system (MEMS) bond release structure and method of wafer transfer for three-dimensional integrated circuit (3D IC) integration
Grant 9,922,956 - Lan , et al. March 20, 2
2018-03-20
Frequency multiplexer
Grant 9,906,318 - Zuo , et al. February 27, 2
2018-02-27
Passive-on-glass (POG) device and method
Grant 9,893,048 - Lan , et al. February 13, 2
2018-02-13
MIM capacitor and method of making the same
Grant 9,875,848 - Berdy , et al. January 23, 2
2018-01-23
Tunable Matching Network
App 20170331445 - Ma; Yunfei ;   et al.
2017-11-16
Integrated circuits (ICS) on a glass substrate
Grant 9,768,109 - Gu , et al. September 19, 2
2017-09-19
Backside coupled symmetric varactor structure
Grant 9,721,946 - Kim , et al. August 1, 2
2017-08-01
Mim Capacitor And Method Of Making The Same
App 20170178810 - BERDY; David Francis ;   et al.
2017-06-22
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
Grant 9,673,275 - Kim , et al. June 6, 2
2017-06-06
Thin Film Magnet Inductor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170140862 - YUN; Changhan Hobie ;   et al.
2017-05-18
Acoustic Resonator Devices
App 20170141756 - Yun; Changhan Hobie ;   et al.
2017-05-18
Isolated Complementary Metal-oxide Semiconductor (cmos) Devices For Radio-frequency (rf) Circuits
App 20170117358 - Kim; Daeik Daniel ;   et al.
2017-04-27
Integrated Circuits (ics) On A Glass Substrate
App 20170098663 - Gu; Shiqun ;   et al.
2017-04-06
Integrated Circuits (ics) On A Glass Substrate
App 20170084531 - Gu; Shiqun ;   et al.
2017-03-23
Wafer Level Package (wlp) Ball Support Using Cavity Structure
App 20170084565 - VELEZ; Mario Francisco ;   et al.
2017-03-23
Substrate-transferred, Deep Trench Isolation Silicon-on-insulator (soi) Semiconductor Devices Formed From Bulk Semiconductor Wafers
App 20170084628 - Kim; Daeik Daniel ;   et al.
2017-03-23
Passive-on-glass (pog) Device And Method
App 20170077079 - Lan; Je-Hsiung Jeffrey ;   et al.
2017-03-16
Backside Coupled Symmetric Varactor Structure
App 20170077093 - KIM; Daeik Daniel ;   et al.
2017-03-16
Augmented Capacitor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170077214 - MUDAKATTE; Niranjan Sunil ;   et al.
2017-03-16
Substrate Comprising An Embedded Inductor And A Thin Film Magnetic Core
App 20170062120 - Yun; Changhan Hobie ;   et al.
2017-03-02
Tunable Cavity Resonator
App 20170033429 - Berdy; David Francis ;   et al.
2017-02-02
Devices and methods to reduce stress in an electronic device
Grant 9,560,745 - Kim , et al. January 31, 2
2017-01-31
Backside coupled symmetric varactor structure
Grant 9,502,586 - Kim , et al. November 22, 2
2016-11-22
Silicon-on-insulator (soi) Wafers Employing Molded Substrates To Improve Insulation And Reduce Current Leakage
App 20160293477 - Kim; Daeik Daniel ;   et al.
2016-10-06
Metal-insulator-metal (mim) Capacitors Arranged In A Pattern To Reduce Inductance, And Related Methods
App 20160181233 - Yun; Changhan Hobie ;   et al.
2016-06-23
Stress mitigation structure for wafer warpage reduction
Grant 9,343,403 - Lan , et al. May 17, 2
2016-05-17
Devices And Methods To Reduce Stress In An Electronic Device
App 20160095208 - Kim; Daeik Daniel ;   et al.
2016-03-31
Microelectromechanical System (mems) Bond Release Structure And Method Of Wafer Transfer For Three-dimensional Integrated Circuit (3d Ic) Integration
App 20160093591 - LAN; Je-Hsiung Jeffrey ;   et al.
2016-03-31
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
Grant 9,264,013 - Zuo , et al. February 16, 2
2016-02-16
Frequency Multiplexer
App 20150304059 - Zuo; Chengjie ;   et al.
2015-10-22
Stress Mitigation Structure For Wafer Warpage Reduction
App 20150287677 - LAN; Je-Hsiung Jeffrey ;   et al.
2015-10-08
Compact 3-D coplanar transmission lines
Grant 9,136,574 - Kim , et al. September 15, 2
2015-09-15
Complex passive design with special via implementation
Grant 9,001,031 - Lo , et al. April 7, 2
2015-04-07
Integrated passives and power amplifier
Grant 8,970,516 - Black , et al. March 3, 2
2015-03-03
Compact 3-d Coplanar Transmission Lines
App 20140361854 - Kim; Daeik Daniel ;   et al.
2014-12-11
High Density, Low Loss 3-d Through-glass Inductor With Magnetic Core
App 20140247269 - Berdy; David Francis ;   et al.
2014-09-04
Hybrid Filter Including Lc- And Mems-based Resonators
App 20140035702 - Black; Justin Phelps ;   et al.
2014-02-06
Complex Passive Design With Special Via Implementation
App 20140028543 - Lo; Chi Shun ;   et al.
2014-01-30
High Quality Factor Planar Inductors
App 20130293337 - Lo; Chi Shun ;   et al.
2013-11-07
Piezoelectric Resonator With Airgap
App 20130235001 - YUN; Changhan Hobie ;   et al.
2013-09-12
Integrated Passives And Power Amplifier
App 20120075216 - Black; Justin Phelps ;   et al.
2012-03-29

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