| Patent | Date |
|---|
Structure and method of high performance two layer ball grid array substrate
Grant 7,795,072 - Lamson , et al. September 14, 2 | 2010-09-14 |
Structure and method of high performance two layer ball grid array substrate
App 20080195990 - Lamson; Michael A. ; et al. | 2008-08-14 |
IC package with integral vertical passive delay cells
App 20080157385 - Yue; Heping ; et al. | 2008-07-03 |
Wire bonded semiconductor device having low inductance and noise
Grant 7,265,443 - Test , et al. September 4, 2 | 2007-09-04 |
Low capacitance coupling wire bonded semiconductor device
Grant 7,195,954 - Lamson , et al. March 27, 2 | 2007-03-27 |
Semiconductor package with conductor impedance selected during assembly
Grant 7,132,740 - Lamson , et al. November 7, 2 | 2006-11-07 |
Wire bonded semiconductor device having low inductance and noise
App 20060244154 - Test; Howard R. ; et al. | 2006-11-02 |
Structure and method of high performance two layer ball grid array substrate
App 20060063304 - Lamson; Michael A. ; et al. | 2006-03-23 |
Structure and method of high performance two layer ball grid array substrate
Grant 6,995,037 - Lamson , et al. February 7, 2 | 2006-02-07 |
System and method for delivering power to a semiconductor device
App 20050133901 - Edwards, Darvin R. ; et al. | 2005-06-23 |
Low capacitance coupling wire bonded semiconductor device
Grant 6,822,340 - Lamson , et al. November 23, 2 | 2004-11-23 |
System for electrically modeling an electronic structure and method of operation
Grant 6,820,046 - Lamson , et al. November 16, 2 | 2004-11-16 |
Low capacitance coupling wire bonded semiconductor device
App 20040207096 - Lamson, Michael A. ; et al. | 2004-10-21 |
Structure and method of high performance two layer ball grid array substrate
Grant 6,794,743 - Lamson , et al. September 21, 2 | 2004-09-21 |
Structure and method of high performance two layer ball grid array substrate
App 20040108586 - Lamson, Michael A. ; et al. | 2004-06-10 |
Semiconductor package with conductor impedance selected during assembly
App 20030201519 - Lamson, Michael A. ; et al. | 2003-10-30 |
Semiconductor package with conductor impedance selected during assembly
Grant 6,563,208 - Lamson , et al. May 13, 2 | 2003-05-13 |
Low pass filter integral with semiconductor package
Grant 6,424,027 - Lamson , et al. July 23, 2 | 2002-07-23 |
Low capacitance coupling wire bonded semiconductor device
App 20020089069 - Lamson, Michael A. ; et al. | 2002-07-11 |
Semiconductor package with conductor impedance selected during assembly
App 20020003291 - Lamson, Michael A. ; et al. | 2002-01-10 |
Differential pair geometry for integrated circuit chip packages
Grant 6,323,116 - Lamson November 27, 2 | 2001-11-27 |
Ball grid array package
Grant 6,084,777 - Kalidas , et al. July 4, 2 | 2000-07-04 |
Interposer having a cantilevered ball connection and being electrically connected to a printed circuit board
Grant 6,064,576 - Edwards , et al. May 16, 2 | 2000-05-16 |
Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation
Grant 5,442,233 - Anjoh , et al. August 15, 1 | 1995-08-15 |
Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer
Grant 5,233,220 - Lamson , et al. August 3, 1 | 1993-08-03 |
Integrated circuit device having bumped power supply buses over active surface areas and method of manufacture thereof
Grant 5,083,187 - Lamson , et al. January 21, 1 | 1992-01-21 |
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