LAMPRECHT; Sven

Patent Applications and Registrations

Patent applications and USPTO patent grants for LAMPRECHT; Sven.The latest application filed is for "manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board".

Company Profile

1.11.16

LAMPRECHT; Sven - Berlin DE
Lamprecht; Sven - Oberkramer/Eichstdt DE
Lamprecht; Sven - Oberkramer/Eichstadt DE
Lamprecht; Sven - Oberkramer DE
Lamprecht; Sven - Lessingstr DE
Lamprecht, Sven - Eichstadt DE
Lamprecht, Sven - Germany DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing Sequences For High Density Interconnect Printed Circuit Boards And A High Density Interconnect Printed Circuit Board App 20220304164 - OZKOK; Akif ; et al.	2022-09-22
Method of forming a solderable solder deposit on a contact pad Grant 11,032,914 - Matejat , et al. June 8, 2	2021-06-08
Method Of Forming A Solderable Solder Deposit On A Contact Pad App 20190350088 - MATEJAT; Kai-Jens ; et al.	2019-11-14
Method for fine line manufacturing Grant 10,151,980 - Baron , et al. Dec	2018-12-11
Method For Fine Line Manufacturing App 20170336710 - BARON; David Thomas ; et al.	2017-11-23
Plated electrical contacts for solar modules Grant 9,680,042 - Voss , et al. June 13, 2	2017-06-13
Method For Metallization Of Solar Cell Substrates App 20150349152 - VOSS; Torsten ; et al.	2015-12-03
Plated Electrical Contacts For Solar Modules App 20150318428 - VOSS; Torsten ; et al.	2015-11-05
Method to form solder deposits on substrates Grant 8,871,631 - Lamprecht , et al. October 28, 2	2014-10-28
Method to form solder deposits on substrates Grant 8,507,376 - Ewert , et al. August 13, 2	2013-08-13
Method to form solder alloy deposits on substrates Grant 8,497,200 - Matejat , et al. July 30, 2	2013-07-30
Method To Form Solder Deposits On Substrates App 20130168438 - Lamprecht; Sven ; et al.	2013-07-04
Method To Form Solder Deposits And Non-melting Bump Structures On Substrates App 20130105329 - Matejat; Kai-Jens ; et al.	2013-05-02
Method To Form Solder Alloy Deposits On Substrates App 20130082091 - Matejat; Kai-Jens ; et al.	2013-04-04
Method To Form Solder Deposits On Substrates App 20110189848 - Ewert; Ingo ; et al.	2011-08-04
Process For The Preparation Of Electrodes For Use In A Fuel Cell App 20100187121 - Metzger; Dieter ; et al.	2010-07-29
Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method Grant 7,520,973 - Matejat , et al. April 21, 2	2009-04-21
Mehtod for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method App 20060175204 - Matejat; Kai-Jens ; et al.	2006-08-10
Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof Grant 6,899,803 - Matejat , et al. May 31, 2	2005-05-31
Regeneration method for a plating solution App 20040245108 - Beck, Thomas ; et al.	2004-12-09
Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof App 20030000842 - Matejat, Kai-Jens ; et al.	2003-01-02

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