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Patent applications and USPTO patent grants for Lammert; Michael D..The latest application filed is for "via formation in polymers".
Patent | Date |
---|---|
Automated spray cleaning apparatus for semiconductor wafers Grant 6,638,366 - Lammert , et al. October 28, 2 | 2003-10-28 |
Via formation in polymers App 20030082906 - Lammert, Michael D. | 2003-05-01 |
Automated spray cleaning apparatus for semiconductor wafers App 20020170579 - Lammert, Michael D. ;   et al. | 2002-11-21 |
Method for controlling the sheet resistance of thin film resistors App 20020117470 - Lammert, Michael D. | 2002-08-29 |
Method of fabricating HBT devices Grant 6,406,965 - Lammert June 18, 2 | 2002-06-18 |
Planar airbridge RF terminal MEMS switch Grant 6,218,911 - Kong , et al. April 17, 2 | 2001-04-17 |
Method of forming airbridged metallization for integrated circuit fabrication Grant 5,817,446 - Lammert October 6, 1 | 1998-10-06 |
Method of fabricating high .beta.HBT devices Grant 5,804,487 - Lammert September 8, 1 | 1998-09-08 |
Method of forming closely spaced metal electrodes in a semiconductor device Grant 5,486,483 - Lammert January 23, 1 | 1996-01-23 |
Formation of buried diffusion devices Grant 4,711,017 - Lammert December 8, 1 | 1987-12-08 |
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