Lambert; William James
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lambert; William James.The latest application filed is for "integrated circuit structures in package substrates".
- Lambert; William James - Chandler AZ
| Patent | Date |
|---|---|
| Antenna modules and communication devices Grant 11,380,979 - Dalmia , et al. July 5, 2 | 2022-07-05 |
| Integrated Circuit Structures In Package Substrates App 20210351116 - Ganesan; Sanka ; et al. | 2021-11-11 |
| Antenna Modules And Communication Devices App 20210344116 - Dalmia; Sidharth ; et al. | 2021-11-04 |
| Antenna modules and communication devices Grant 11,121,468 - Dalmia , et al. September 14, 2 | 2021-09-14 |
| Integrated circuit structures in package substrates Grant 11,107,757 - Ganesan , et al. August 31, 2 | 2021-08-31 |
| Tunable Capacitor Arrangements In Integrated Circuit Package Substrates App 20210066265 - Eid; Feras ; et al. | 2021-03-04 |
| Antenna Modules And Communication Devices App 20200403316 - Dalmia; Sidharth ; et al. | 2020-12-24 |
| Antenna modules and communication devices Grant 10,797,394 - Dalmia , et al. October 6, 2 | 2020-10-06 |
| Radio Frequency Front-end Structures App 20200253040 - Kind Code | 2020-08-06 |
| Integrated Circuit Structures In Package Substrates App 20200251411 - Kind Code | 2020-08-06 |
| Antenna Boards And Communication Devices App 20200203839 - Karhade; Omkar G. ; et al. | 2020-06-25 |
| Integrated circuit structures in package substrates Grant 10,672,693 - Ganesan , et al. | 2020-06-02 |
| Antenna Modules And Communication Devices App 20190372229 - Dalmia; Sidharth ; et al. | 2019-12-05 |
| Antenna Modules And Communication Devices App 20190305402 - Dalmia; Sidharth ; et al. | 2019-10-03 |
| Integrated Circuit Structures In Package Substrates App 20190304887 - Ganesan; Sanka ; et al. | 2019-10-03 |
| Antenna Modules And Communication Devices App 20190260110 - Thai; Trang ; et al. | 2019-08-22 |
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