| Patent | Date |
|---|
Antenna Modules And Communication Devices
App 20220278439 - Dalmia; Sidharth ; et al. | 2022-09-01 |
5G mmWAVE COOLING THROUGH PCB
App 20220256715 - MANI; Divya ; et al. | 2022-08-11 |
Thermals For Packages With Inductors
App 20220238410 - Lambert; William J. | 2022-07-28 |
Antenna Package Using Ball Attach Array To Connect Antenna And Base Substrates
App 20220216611 - Yao; Jimin ; et al. | 2022-07-07 |
Antenna package using ball attach array to connect antenna and base substrates
Grant 11,355,849 - Yao , et al. June 7, 2 | 2022-06-07 |
Thermals for packages with inductors
Grant 11,335,618 - Lambert May 17, 2 | 2022-05-17 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20220102261 - ELSHERBINI; Adel A. ; et al. | 2022-03-31 |
Magnetic Core Inductors In Interposer
App 20220093536 - BHARATH; Krishna ; et al. | 2022-03-24 |
Package Embedded Magnetic Power Transformers For Smps
App 20220093314 - MODI; Anuj ; et al. | 2022-03-24 |
Multi-phase Switching Regulators With Hybrid Inductors And Per Phase Frequency Control
App 20220094263 - BHARATH; Krishna ; et al. | 2022-03-24 |
High performance integrated RF passives using dual lithography process
Grant 11,227,825 - Elsherbini , et al. January 18, 2 | 2022-01-18 |
High-throughput Additively Manufactured Power Delivery Vias And Traces
App 20210407903 - Elsherbini; Adel ; et al. | 2021-12-30 |
Reconfigurable inductor
Grant 11,211,866 - Lambert , et al. December 28, 2 | 2021-12-28 |
Helical Plated Through-hole Package Inductor
App 20210304952 - Lambert; William J. ; et al. | 2021-09-30 |
5G mmWave cooling through PCB
Grant 11,112,841 - Mani , et al. September 7, 2 | 2021-09-07 |
Keep Out Zone With Hydrophobic Surface For Integrated Circuit (ic) Package
App 20210233867 - ZIADEH; Bassam ; et al. | 2021-07-29 |
Method of making an inductor
Grant 10,998,120 - Lambert , et al. May 4, 2 | 2021-05-04 |
Package Embedded Magnetic Inductor Structures And Manufacturing Techniques For 5-50 Mhz Smps Operations
App 20210125944 - LAMBERT; William J. ; et al. | 2021-04-29 |
Reconfigurable Inductor
App 20210036618 - Lambert; WILLIAM J. ; et al. | 2021-02-04 |
Package architecture for antenna arrays
Grant 10,868,366 - Elsherbini , et al. December 15, 2 | 2020-12-15 |
Antenna Package Using Ball Attach Array To Connect Antenna And Base Substrates
App 20200303822 - YAO; Jimin ; et al. | 2020-09-24 |
Magnetic small footprint inductor array module for on-package voltage regulator
Grant 10,741,536 - Min , et al. A | 2020-08-11 |
Magnetic Mold Material Inductors For Electronic Packages
App 20200203470 - Dhane; Kedar ; et al. | 2020-06-25 |
Edge-firing antenna walls built into substrate
Grant 10,658,765 - Chavali , et al. | 2020-05-19 |
5g Mmwave Antenna Architecture With Thermal Management
App 20200076046 - KARHADE; Omkar ; et al. | 2020-03-05 |
Wirebond And Leadframe Magnetic Inductors
App 20200066659 - Lambert; William J. ; et al. | 2020-02-27 |
Package Architecture For Antenna Arrays
App 20200036095 - ELSHERBINI; Adel A. ; et al. | 2020-01-30 |
Thermals For Packages With Inductors
App 20200013693 - Lambert; William J. | 2020-01-09 |
Edge-firing Antenna Walls Built Into Substrate
App 20200006866 - Chavali; Sri Chaitra Jyotsna ; et al. | 2020-01-02 |
Integrated Heterogenous Power Management Circuitries
App 20200006305 - Lambert; William J. ; et al. | 2020-01-02 |
5G mmWAVE COOLING THROUGH PCB
App 20190377392 - MANI; Divya ; et al. | 2019-12-12 |
Apparatus and method to reduce power losses in an integrated voltage regulator
Grant 10,503,227 - Bharath , et al. Dec | 2019-12-10 |
Magnetic Small Footprint Inductor Array Module For On-package Voltage Regulator
App 20190279973 - Min; Yongki ; et al. | 2019-09-12 |
Magnetic small footprint inductor array module for on-package voltage regulator
Grant 10,340,260 - Min , et al. | 2019-07-02 |
Helical Plated Through-hole Package Inductor
App 20190051447 - Lambert; William J. ; et al. | 2019-02-14 |
Helical plated through-hole package inductor
Grant 10,163,557 - Lambert , et al. Dec | 2018-12-25 |
Component stiffener architectures for microelectronic package structures
Grant 10,157,860 - Karhade , et al. Dec | 2018-12-18 |
Vertically Embedded Passive Components
App 20180332708 - LAMBERT; William J. ; et al. | 2018-11-15 |
Integrated Voltage Regulator With Augmented Current Source
App 20180323708 - LAMBERT; William J. ; et al. | 2018-11-08 |
High Performance Integrated Rf Passives Using Dual Lithography Process
App 20180315690 - ELSHERBINI; Adel A. ; et al. | 2018-11-01 |
Magnetic Small Footprint Inductor Array Module For On-package Voltage Regulator
App 20180197845 - Min; Yongki ; et al. | 2018-07-12 |
Component Stiffener Architectures For Microelectronic Package Structures
App 20180182718 - Karhade; Omkar G. ; et al. | 2018-06-28 |
Systems and methods for controlled effective series resistance component
Grant 9,992,871 - Lambert , et al. June 5, 2 | 2018-06-05 |
Apparatus And Method To Reduce Power Losses In An Integrated Voltage Regulator
App 20180101207 - Bharath; Krishna ; et al. | 2018-04-12 |
Magnetic small footprint inductor array module for on-package voltage regulator
Grant 9,911,723 - Min , et al. March 6, 2 | 2018-03-06 |
Hybrid pitch package with ultra high density interconnect capability
Grant 9,899,311 - Manusharow , et al. February 20, 2 | 2018-02-20 |
High density interconnection of microelectronic devices
Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
Apparatus and method to reduce power losses in an integrated voltage regulator
Grant 9,753,510 - Bharath , et al. September 5, 2 | 2017-09-05 |
Helical Plated Through-hole Package Inductor
App 20170178786 - Lambert; William J. ; et al. | 2017-06-22 |
Magnetic Small Footprint Inductor Array Module For On-package Voltage Regulator
App 20170179094 - Min; Yongki ; et al. | 2017-06-22 |
Magnetic Material Coated Wire Inductor
App 20170169932 - Lambert; William J. ; et al. | 2017-06-15 |
Systems And Methods For Controlled Effective Series Resistance Component
App 20170135211 - Lambert; William J. ; et al. | 2017-05-11 |
Hybrid pitch package with ultra high density interconnect capability
Grant 9,633,938 - Manusharow , et al. April 25, 2 | 2017-04-25 |
Hybrid Pitch Package With Ultra High Density Interconnect Capability
App 20170092575 - Manusharow; Mathew J. ; et al. | 2017-03-30 |
Package Integrated Power Inductors Using Lithographically Defined Vias
App 20170092412 - Manusharow; Mathew J. ; et al. | 2017-03-30 |
Hybrid Pitch Package With Ultra High Density Interconnect Capability
App 20170092573 - MANUSHAROW; Mathew J. ; et al. | 2017-03-30 |
Apparatus And Method To Reduce Power Losses In An Integrated Voltage Regulator
App 20170060205 - Bharath; Krishna ; et al. | 2017-03-02 |
Tsv-connected Backside Decoupling
App 20170012029 - LAMBERT; William J. ; et al. | 2017-01-12 |
High Density Interconnection Of Microelectronic Devices
App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
High density interconnection of microelectronic devices
Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
Die Assembly On Thin Dielectric Sheet
App 20160043056 - Chiu; Chia-Pin ; et al. | 2016-02-11 |
Techniques and configurations associated with a capductor assembly
Grant 9,230,944 - Lambert , et al. January 5, 2 | 2016-01-05 |
Die assembly on thin dielectric sheet
Grant 9,177,831 - Chiu , et al. November 3, 2 | 2015-11-03 |
High Density Interconnection Of Microelectronic Devices
App 20150163904 - Karhade; Omkar G. ; et al. | 2015-06-11 |
Die Assembly On Thin Dielectric Sheet
App 20150091182 - Chiu; Chia-Pin ; et al. | 2015-04-02 |
Transient voltage compensation system and method
Grant 8,243,410 - Ayyanar , et al. August 14, 2 | 2012-08-14 |
Transient Voltage Compensation System And Method
App 20090279224 - Ayyanar; Rajapandian ; et al. | 2009-11-12 |
Prolonged delivery of peptides
App 20060003918 - Kim; Yesook ; et al. | 2006-01-05 |
Prolonged delivery of peptides
Grant 6,828,303 - Kim , et al. December 7, 2 | 2004-12-07 |
System and method for measuring freeze dried cake resistance
Grant 6,643,950 - Lambert , et al. November 11, 2 | 2003-11-11 |
Prolonged delivery of peptides
App 20030050237 - Kim, Yesook ; et al. | 2003-03-13 |
System and method for measuring freeze dried cake resistance
App 20020121099 - Lambert, William J. ; et al. | 2002-09-05 |
Prolonged delivery of peptides
Grant 6,284,727 - Kim , et al. September 4, 2 | 2001-09-04 |
System for controlling data flow
Grant 4,488,224 - Ippolito , et al. December 11, 1 | 1984-12-11 |
Random Access Article Selection Of System And Apparatus Therefor
Grant 3,672,497 - Lambert June 27, 1 | 1972-06-27 |
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