Lambert; Ulrich

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lambert; Ulrich.The latest application filed is for "monocrystalline semiconductor wafer comprising defect-reduced regions and method for producing it".

Company Profile

1.6.5

Lambert; Ulrich - Emmerting DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Monocrystalline semiconductor wafer comprising defect-reduced regions and method for producing it Grant 8,216,361 - Knerer , et al. July 10, 2	2012-07-10
Monocrystalline semiconductor wafer comprising defect-reduced regions and method for producing it Grant 8,088,219 - Knerer , et al. January 3, 2	2012-01-03
Monocrystalline Semiconductor Wafer Comprising Defect-Reduced Regions and Method For Producing It App 20110318546 - Knerer; Dieter ; et al.	2011-12-29
Process for producing silicon semiconductor wafers with defined defect properties, and silicon semiconductor wafers having these defect properties Grant 7,387,676 - von Ammon , et al. June 17, 2	2008-06-17
Monocrystalline Semiconductor Wafer Comprising Defect-Reduced Regions And Method For Producing It App 20080026232 - Knerer; Dieter ; et al.	2008-01-31
Process for producing silicon semiconductor wafers with defined defect properties, and silicon semiconductor wafers having these defect properties App 20060283374 - Ammon; Wilfried von ; et al.	2006-12-21
SOI wafer and process for producing it Grant 7,122,865 - Holzl , et al. October 17, 2	2006-10-17
Method for the production of a silica glass crucible with crystalline regions from a porous silica glass green body Grant 6,946,030 - Schwertfeger , et al. September 20, 2	2005-09-20
SOI wafer and process for producing IT App 20040251500 - Holzl, Robert ; et al.	2004-12-16
Method for the production of a silica glass crucible with crystalline regions from a porous silica glass green body App 20030159648 - Schwertfeger, Fritz ; et al.	2003-08-28
Process for producing silicon semiconductor wafers with low defect density Grant 5,935,320 - Graef , et al. August 10, 1	1999-08-10

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