Lambert; Andy
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lambert; Andy.The latest application filed is for "hearing device with embedded die stack".
- Lambert; Andy - Eagan MN
- Lambert; Andy - Eden Prairie MN
| Patent | Date |
|---|---|
| Hearing Device With Embedded Die Stack App 20170366906 - Lambert; Andy | 2017-12-21 |
| Reflow solderable flexible circuit board -- to -- flexible circuit board connector reinforcement Grant 9,474,154 - Johansson , et al. October 18, 2 | 2016-10-18 |
| Reflow Solderable Flexible Circuit Board-to-flexible Circuit Board Connector Reinforcement App 20160021742 - Johansson; Susie ; et al. | 2016-01-21 |
| Integrated Circuit Die Inside A Flexible Circuit Substrate For A Hearing Assistance Device App 20150071470 - Link; Douglas F ; et al. | 2015-03-12 |
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