Lamb; James E. III

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lamb; James E. III.The latest application filed is for "automated process and apparatus for planarization of topographical surfaces".

Company Profile

0.0.18

Lamb; James E. III - Rolla MO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Automated Process And Apparatus For Planarization Of Topographical Surfaces App 20070105384 - McCutcheon; Jeremy ; et al.	2007-05-10
Patterned structure reproduction using nonsticking mold App 20050167894 - Shih, Wu-sheng ; et al.	2005-08-04
Crosslinkable fill compositons for uniformly protecting via and contact holes App 20050159520 - Lamb, James E. III ; et al.	2005-07-21
Lithography pattern shrink process and articles App 20050147901 - Sabnis, Ram W. ; et al.	2005-07-07
Fill material for dual damascene processes App 20040147108 - Lamb, James E. III ; et al.	2004-07-29
Crosslinkable fill compositions for uniformly protecting via and contact holes App 20040034134 - Lamb, James E. III ; et al.	2004-02-19
Novel planarization method for multi-layer lithography processing App 20040029041 - Shih, Wu-Sheng ; et al.	2004-02-12
Anti-reflective coating compositions for use with low k dielectric materials App 20030234387 - Puligadda, Rama ; et al.	2003-12-25
Lithography pattern shrink process and articles App 20030203320 - Sabnis, Ram W. ; et al.	2003-10-30
Fill material for dual damascene processes App 20030148601 - Lamb, James E. III ; et al.	2003-08-07
Contact planarization materials that generate no volatile byproducts or residue during curing App 20030129542 - Shih, Wu-Sheng ; et al.	2003-07-10
Patterned structure reproduction using nonsticking mold App 20030071016 - Shih, Wu-Sheng ; et al.	2003-04-17
Anti-reflective coating compositions for use with low k dielectric materials App 20030004283 - Puligadda, Rama ; et al.	2003-01-02
Anti-reflective coating compositions for use with low k dielectric materials App 20020198333 - Puligadda, Rama ; et al.	2002-12-26
Crosslinkable fill compositions for uniformly protecting via and contact holes App 20020183426 - Lamb, James E. III ; et al.	2002-12-05
Fill material for dual damascene processes App 20020041953 - Lamb, James E. III ; et al.	2002-04-11
Fill material for dual damascene processes App 20020016057 - Lamb, James E. III ; et al.	2002-02-07
Fill material for dual damascene processes App 20010056144 - Lamb, James E. III ; et al.	2001-12-27

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