Lam; Wing Keung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lam; Wing Keung.The latest application filed is for "semiconductor packages and methods of packaging semiconductor devices".

Company Profile

1.8.2

Lam; Wing Keung - Dongguan CN
Lam; Wing Keung - Kowloon CN
Lam; Wing Keung - KLN HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked dies electrically connected to a package substrate by lead terminals Grant 11,227,818 - Lam , et al. January 18, 2	2022-01-18
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20210035891 - LAM; Wing Keung ; et al.	2021-02-04
Ball grid array package with improved thermal characteristics Grant 9,449,903 - McLellan , et al. September 20, 2	2016-09-20
Ball Grid Array Package With Improved Thermal Characteristics App 20140183712 - McLellan; Neil ; et al.	2014-07-03
Ball grid array package with improved thermal characteristics Grant 8,610,262 - McLellan , et al. December 17, 2	2013-12-17
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader Grant 7,315,080 - Fan , et al. January 1, 2	2008-01-01
Ball grid array package and process for manufacturing same Grant 6,987,032 - Fan , et al. January 17, 2	2006-01-17
Ball grid array package with improved thermal characteristics Grant 6,737,755 - McLellan , et al. May 18, 2	2004-05-18
Die-up tape ball grid array package Grant 6,586,834 - Sze , et al. July 1, 2	2003-07-01

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