Lam; Si-Tuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lam; Si-Tuan.The latest application filed is for "etching process to selectively remove copper plating seed layer".
- Lam; Si-Tuan - San Jose CA
| Patent | Date |
|---|---|
| Etching process to selectively remove copper plating seed layer Grant 6,767,477 - Wu , et al. July 27, 2 | 2004-07-27 |
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