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Patent applications and USPTO patent grants for Lam; Man K..The latest application filed is for "carrierles surface mounted integrated circuit die".
Patent | Date |
---|---|
Carrierles surface mounted integrated circuit die Grant 5,138,115 - Lam August 11, 1 | 1992-08-11 |
Method of manufacturing a repairable multi-chip module Grant 5,137,836 - Lam August 11, 1 | 1992-08-11 |
Snap-fit construction low cost pressure sensing device Grant 5,031,462 - Lam July 16, 1 | 1991-07-16 |
Low cost wet-to-wet pressure sensor package Grant 4,942,383 - Lam , et al. July 17, 1 | 1990-07-17 |
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